Methods of treatment using topical copper ion formulations
AssigneeCda Research Group, Inc.
InventorsDominic C. ABBOTT, ChunLim ABBOTT
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AssigneeCda Research Group, Inc.
InventorsDominic C. ABBOTT, ChunLim ABBOTT
Estimating the term…
Provided herein are topical formulations containing copper ions and methods of treating inflammatory, microbial, and arthritic conditions in various areas of the body using such formulations. Methods of treating osteoarthritis using topical copper ion treatments are provided. Methods of treating and preventing microbial infections using copper ion treatments are further provided, including methods of preventing biofilm. A topical treatment in its basic form comprises a biocompatible copper ion solution or suspension obtained by leaching of the copper ions from copper metal. The copper ion solution or suspension is combined with various carriers to form the copper ion treatment including creams, gels, lotions, foams, pastes, tampons, solutions, suppositories, body wipes, wound dressings, skin patches, and suture material. Methods of making the copper ion solution or suspension from solid copper metal in a biocompatible solution are also provided.
A method of treating a condition that causes pain and/or swelling of a joint comprising topically administering a pharmaceutically acceptable formulation comprising copper ions 1-3 times daily to a human in need of such treatment.
A pharmaceutically acceptable formulation comprising copper ions for use in treatment of a condition causing pain and/or swelling of a joint.
A method of preventing biofilm formation by administering a formulation comprising copper ions to a human in need of such treatment.
A formulation comprising copper ions for use in preventing biofilm.
Dependencies are inferred from the claim text.