Method for manufacturing mount assembly, mounting jig, apparatus for manufacturing mount assembly, imaging apparatus, and endoscope apparatus

A mounting jig for connecting a plurality of pins and a plurality of electronic components to a same surface of a substrate, each of the plurality of pins including a connecting section and a shaft section having a diameter smaller than that of the connecting section, a height of each of the plurality of electronic components being not larger than that of each of the plurality of pins when being mounted,

• the mounting jig comprising:
• a plurality of pin insertion holes into each of which the shaft section of each of the pins is configure to be inserted;
• and
• a plurality of electronic component insertion holes into which the electronic components respectively are configured to be inserted, wherein
• when the pins and the electronic components are set into the pin insertion holes and the electronic component insertion holes, respectively, a top surface of the connecting section of each of the pins and a top surface of each of the electronic components are located above a top surface of the mounting jig, and the top surface of each of the electronic components is located lower than the top surface of the connecting section of each of the pins.

An imaging apparatus comprising:

• an image sensor chip;
• and
• a mount assembly, wherein
• the mount assembly includes:
• a substrate;
• a plurality of first pins which is mounted on a first surface of the substrate and each of which has a first connecting section and a first shaft section having a diameter smaller than that of the first connecting section;
• at least one first electronic component which is mounted on the first surface of the substrate and whose height is not larger than that of each of the first pins when being mounted;
• a first resin sealant configured to seal the first surface so as to expose an end face of the first shaft section opposite to where the first connecting section is provided;
• a plurality of second pins which is mounted on a second surface of the substrate and each of which has a second connecting section and a second shaft section having a diameter smaller than that of the second connecting section;
• at least one second electronic component which is mounted on the second surface of the substrate and whose height is not larger than that of each of the second pins when being mounted;
• and
• a second resin sealant configured to seal the second surface so as to expose an end face of the second shaft section opposite to where the second connecting section is provided,
• the image sensor chip includes:
• a light receiving unit configured to perform photoelectric conversion on an incident optical signal;
• and
• a back-surface electrode provided on a surface facing the light receiving unit by through-wiring, wherein
• the first shaft section exposed on the first resin sealant is connected to the back-surface electrode, and thereby the image sensor chip is connected to the mount assembly.