# US 2016/0366758 A1 · Electronic device with hollowed-out rear plate

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- Number: US 2016/0366758 A1
- Document ID: US20160366758A1
- Status: Published application
- Kind: A1
- Application number: 14/956,512
- Filed: 2015-12-02
- Published: 2016-12-15
- Earliest claimed: 2015-06-12
- Assignees: STMicroelectronics (Crolles 2) SAS; STMicroelectronics S.r.l.
- Applicants: Stmicroelectronics (Crolles 2) SAS; Stmicroelectronics SA
- Inventors: Nicolas HOTELLIER; François GUYADER; Vincent FIORI; Richard FOURNEL; Frédéric GIANESELLO
- Web page: https://patentgrep.com/patent/US20160366758A1

## CPC

- H05K 1/0216: {Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215)}
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 1/181: associated with surface mounted components
- H05K 3/0011: {Working of insulating substrates or insulating layers}
- H10D 62/117: {Shapes of semiconductor bodies}
- H10P 90/1906: {Preparing SOI wafers}
- H10W 10/011: {of isolation regions comprising dielectric materials}
- H10W 10/021: {of air gaps}
- H10W 10/10: Isolation regions comprising dielectric materials
- H10W 10/181: {Semiconductor-on-insulator [SOI] isolation regions, e.g. buried oxide regions of SOI wafers}
- H10W 10/20: Air gaps
- H10W 72/019: {of bond pads}
- H10W 72/59: Bond pads specially adapted therefor
- H10W 72/90: Bond pads, in general
- H10W 72/983: {Reinforcing structures, e.g. collars}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An electronic device has a rear plate that includes a substrate rear layer, a substrate front layer and a dielectric intermediate layer between the substrate rear and front layers. An electronic structure is on the substrate front layer and includes electronic components and electrical connections. The substrate rear layer includes a solid local region and a hollowed-out local region. The hollowed-out local region extends over all of the substrate rear layer. The substrate rear layer does not cover at least one local zone of the dielectric intermediate layer corresponding to the hollowed-out local region.

## Claims

### Claim at position 1

1-10. (canceled)

### Claim 11

An electronic device comprising:
a rear plate comprising a substrate rear layer, a substrate front layer and a dielectric intermediate layer between said substrate rear and front layers;
an electronic structure on the substrate front layer and comprising electronic components and electrical connections; and
said substrate rear layer including at least one solid local region and at least one hollowed-out local region, with the at least one hollowed-out local region extending over an entire thickness of said substrate rear layer so that said substrate rear layer does not cover at least one local zone of a rear face of said dielectric intermediate layer, with the at least one local zone corresponding to the at least one hollowed-out local region.

### Claim 12 (depends on 11)

The electronic device according to claim 11, wherein said electronic structure comprises at least one external electrical contact pad; and wherein said at least one solid local region extends over an entire thickness of said rear plate and overlies said at least one external electrical contact pad.

### Claim 13 (depends on 11)

The electronic device according to claim 11, wherein said at least one hollowed-out local region overlies at least one of said electronic components of said electronic structure.

### Claim 14 (depends on 11)

The electronic device according to claim 11, further comprising at least one dielectric filling material filling said at least one hollowed-out local region.

### Claim 15 (depends on 14)

The electronic device according to claim 14, wherein said at least one solid local region has a rear face; and wherein said at least one dielectric filling material has a rear face aligned with the rear face of said at least one solid local region.

### Claim 16 (depends on 14)

The electronic device according to claim 14, wherein said at least one solid local region has a rear face; wherein said dielectric filling material covers the rear face of said at least one solid region; and wherein said dielectric filling material has a rear face parallel to the rear face of said at least one solid local region.

### Claim 17 (depends on 14)

The electronic device according to claim 14, further comprising an intermediate layer between said at least one dielectric filling material and said at least one solid local region and said dielectric intermediate layer.

### Claim 18 (depends on 11)

The electronic device according to claim 11, wherein said at least one solid local region comprises at least one of a plurality of pillars and a honeycomb-shaped partitioning.

### Claim 19

An electronic device comprising:
a rear plate comprising a substrate rear layer, a substrate front layer and a dielectric intermediate layer between said substrate rear and front layers;
an electronic structure on the substrate front layer, said electronic structure comprising at least one external electrical contact pad, electronic components and electrical connections; and
said substrate rear layer including at least one solid local region and at least one hollowed-out local region,
with the at least one hollowed-out local region extending over an entire thickness of said substrate rear layer so that said substrate rear layer does not cover at least one local zone of said dielectric intermediate layer, the at least one hollowed-out local region overlying at least one of said electronic components, and
with said at least one solid local region extending over an entire thickness of said rear plate and overlying said at least one external electrical contact pad.

### Claim 20 (depends on 19)

The electronic device according to claim 19, further comprising at least one dielectric filling material filling said at least one hollowed-out local region.

### Claim 21 (depends on 20)

The electronic device according to claim 20, wherein said at least one solid local region has a rear face; and wherein said at least one dielectric filling material has a rear face aligned with the rear face of said at least one solid local region.

### Claim 22 (depends on 20)

The electronic device according to claim 20, wherein said at least one solid local region has a rear face; wherein said dielectric filling material covers the rear face of said at least one solid region; and wherein said dielectric filling material has a rear face parallel to the rear face of said at least one solid local region.

### Claim 23 (depends on 20)

The electronic device according to claim 20, further comprising an intermediate layer between said at least one dielectric filling material and said at least one solid local region and said dielectric intermediate layer.

### Claim 24 (depends on 19)

The electronic device according to claim 19, wherein said at least one solid local region comprises at least one of a plurality of pillars and a honeycomb-shaped partitioning.

### Claim 25

A method of making an electronic device comprising a plate including a substrate rear layer, a substrate front layer and a dielectric intermediate layer between the substrate rear and front layers, and an electronic structure on the substrate front layer comprising electronic components and electrical connections, the method comprising:
removing, down to the dielectric intermediate layer, a portion of the substrate rear layer so as to define at least one hollowed-out local region and at least one solid local region; and
with the at least one hollowed-out local region extending over an entire thickness of the substrate rear layer so that the substrate rear layer does not cover at least one local zone of a rear face of the dielectric intermediate layer, with the at least one local zone corresponding to the at least one hollowed-out local region.

### Claim 26 (depends on 25)

The method according to claim 25, wherein the electronic structure comprises at least one external electrical contact pad; and wherein the at least one solid local region extends over an entire thickness of the rear plate and overlies the at least one external electrical contact pad.

### Claim 27 (depends on 25)

The method according to claim 25, wherein the at least one hollowed-out local region overlies at least one of the electronic components of the electronic structure.

### Claim 28 (depends on 25)

The method according to claim 25, further comprising filling the at least one hollowed-out local region with at least one dielectric filling material filling.

### Claim 29 (depends on 28)

The method according to claim 28, wherein the at least one solid local region has a rear face; and wherein the at least one dielectric filling material has a rear face aligned with the rear face of the at least one solid local region.

### Claim 30 (depends on 28)

The method according to claim 28, wherein the at least one solid local region has a rear face; wherein the dielectric filling material covers the rear face of the at least one solid region; and
wherein the dielectric filling material has a rear face parallel to the rear face of the at least one solid local region.

### Claim 31 (depends on 28)

The method according to claim 28, further comprising forming an intermediate layer between the at least one dielectric filling material and the at least one solid local region and the dielectric intermediate layer.

### Claim 32 (depends on 25)

The method according to claim 25, wherein the at least one solid local region comprises at least one of a plurality of pillars and a honeycomb-shaped partitioning.