# US 2016/0365644 A1 · Coupling frames for rfid devices > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2016/0365644 A1 - Document ID: US20160365644A1 - Status: Published application - Kind: A1 - Application number: 15/197,795 - Filed: 2016-06-30 - Published: 2016-12-15 - Earliest claimed: 2011-08-08 - Assignees: Féinics AmaTech Teoranta - Inventors: David Finn; Mustafa Lotya; Darren Molloy - Web page: https://patentgrep.com/patent/US20160365644A1 ## CPC - H01Q 7/00: Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop - B23K 26/361: for deburring or mechanical trimming (B23K26/351 takes precedence) - B23K 26/40: taking account of the properties of the material involved - G06K 19/07747: {at least one of the integrated circuit chips being mounted as a module} - G06K 19/07794: {the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit} - H01Q 1/2225: {used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal} - H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)} - B23K 2101/40: Semiconductor devices - B23K 2103/50: {Inorganic materials other than metals or composite materials} - G06K 19/07722: {the record carrier being multilayered, e.g. laminated sheets (flat articles in general, see B32B37/00)} - H10W 72/932: {Plan-view shape, i.e. in top view} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - G06K: GRAPHICAL DATA READING (image or video recognition or understanding G06V); PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A transponder chip module (TCM) comprises an RFID chip (CM, IC), optionally contact pads (CP), a module antenna (MA), and a coupling frame (CF), all on a common substrate or module tape (MT). The coupling frame (CF) may be in the form of a conductive layer having an outer edge (OE) and a slit (S) or non-conductive stripe (NCS) extending from the outer edge to an inner position thereof which may be a central opening (OP). The coupling frame (CF) may be arranged so that the slit (S) or non-conductive strips (NCS) overlaps at least a portion of the module antenna (MA). Methods and apparatus are disclosed. ## Claims ### Claim 1 An RFID device comprising: a transponder chip module (TCM) comprising an RFID chip (IC) and a module antenna (MA); and a coupling frame (CF) comprising a conductive surface and having an electrical discontinuity comprising a slit (S) or non-conductive stripe (NCS) extending through the surface from an outer edge thereof to an inner position thereof, wherein the coupling frame is disposed so that the slit (S) or non-conductive stripe (NCS) overlaps at least a portion of the module antenna (MA). ### Claim 2 (depends on 1) The RFID device of claim 1, wherein the coupling frame (CF) is disposed in a card body (CB) of a smart card (SC). ### Claim 3 (depends on 1) The RFID device of claim 1, wherein the coupling frame (CF) is disposed on a module tape (MT) of the transponder chip module (TCM). ### Claim 4 (depends on 1) The RFID device of claim 1, wherein the slit (S) or non-conductive stripe (NCS) extends to an opening (OP) in the coupling frame (CF). ### Claim 5 (depends on 1) The RFID device of claim 1, wherein the slit (S) or non-conductive stripe (NCS) extends to an interior position of the coupling frame (CF). ### Claim 6 (depends on 1) The RFID device of claim 1, wherein the slit (S) or non-conductive stripe (NCS) overlaps at least some turns of the module antenna (MA). ### Claim 7 (depends on 1) The RFID device claim 1, wherein: the transponder chip module (TCM) includes a module tape (MT) supporting the RFID chip (IC) and module antenna (MA); and the coupling frame (CF) is disposed on an opposite side of the module tape (MT) from the module antenna (MA, PA). ### Claim 8 (depends on 1) The RFID device claim 1, wherein: the transponder chip module (TCM) includes a module tape (MT) supporting the RFID chip (IC) and module antenna (MA); and the coupling frame (CF) is formed from a conductive layer (CL) on the module tape (MT) which is one of the (i) conductive layer used to form contact pads (CP) on the face-up side of the module tape (MT) and (ii) the conductive layer used to form the module antenna on the face-down side of the module tape (MT). ### Claim 9 (depends on 1) The RFID device claim 1, wherein: the module antenna (MA) comprises an etched planar antenna (PA) having a number of tracks (traces) separated by spaces; wherein: a track width is less than 100 μm; and a spacing between adjacent tracks is less than 75 μm. ### Claim 10 A method of improving coupling between an RFID device comprising a transponder chip module (TCM) and an external reader, the transponder chip module (TCM) comprising an RFID chip (IC, CM) and a module antenna (MA), characterized by: incorporating an open-loop conductive coupling frame (CF) in the transponder chip module (TCM), wherein the coupling frame (CF) has a slit (S) or non-conductive stripe (NCS) extending from an outer edge (OE) thereof to an interior position thereof and coupling frame (CF) is positioned so that the slit (S) or non-conductive stripe (NCS) overlaps at least a portion of the module antenna (MA, PA, LES). ### Claim 11 (depends on 10) The method of claim 10, wherein: the coupling frame (CF) has an opening (OP) at the interior position thereof, and the opening defines an inner edge (IE) of the coupling frame (CF); and the slit (S) or non-conductive stripe (NCS) extends from the opening (OP) to the outer edge (OE) of the coupling frame (CF). ### Claim 12 In conjunction with an RFID device comprising an antenna having a number of tracks or turns separated by spaces, a coupling frame (CF) comprising a conductive surface and having an electrical discontinuity comprising a slit (S) or non-conductive stripe (NCS) extending through the surface from an outer edge thereof to an inner position thereof, wherein the coupling frame is disposed so that the slit (S) overlaps at least a portion of the module antenna (MA).