Semiconductor device
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsTamae TAKANO, Nobuharu OHSAWA, Kiyoshi KATO
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Abstract
When a conductive layer occupying a large area is provided in a coiled antenna portion, it has been difficult to supply power stably. A memory circuit portion and a coiled antenna portion are disposed by being stacked together; therefore, it is possible to prevent a current from flowing through a conductive layer occupying a large area included in the memory circuit portion, and thus, power saving can be achieved. In addition, the memory circuit portion and the coiled antenna portion are disposed by being stacked together, and thus, it is possible to use a space efficiently. Therefore, downsizing can be realized.
Claims1
A semiconductor device comprising:
- an integrated circuit;
- an antenna having a spiral shape as its main structure;
- and
- an element, over a substrate having an insulating surface,
- wherein the element comprises a first electrode, a second electrode and a layer containing an organic compound interposed between the first electrode and the second electrode,
- wherein the antenna is electrically connected to the integrated circuit,
- wherein the first electrode or the second electrode is electrically connected to the integrated circuit, and
- wherein the antenna overlaps with the second electrode.
Dependencies are inferred from the claim text.