Methods of prototyping and manufacturing with cleanspace fabricators

A method for developing or manufacturing a product comprising:

• designing electrical circuits, interconnections between circuits and structural layers to encapsulate and support a device;
• introducing a semiconductor substrate into a cleanspace fabricator, wherein:
• the fabricator comprises at least a first matrix comprising at least two processing tools, each comprising a tool body and a tool port, oriented in a vertical dimension in relation to each other, wherein said processing tools are at least partially located in a first fabricator cleanspace comprising a first boundary and a second boundary and each of the processing tools is capable of independent operation and removable in a discrete fashion relative to other processing tools;
• introducing a rectangular glass substrate into the cleanspace fabricator;
• providing electronic data from a design process to the cleanspace fabricator;
• forming interconnect layers upon at least a first side of the rectangular glass substrate;
• and
• attaching at least a first electronic circuit, which has been fabricated using the semiconductor substrate, to a portion of the interconnect layers.

A method of producing products comprising:

• utilizing a single cleanspace fabricator to perform processing, wherein:
• the cleanspace fabricator comprises a first matrix comprising at least two discrete processing tools, each discrete processing tool comprising a tool body and a tool port, the at least two discrete processing tools oriented one on top of the other along a vertical, wherein said at least two discrete processing tools are partially located in a first fabricator cleanspace comprising a first boundary and a second boundary and each of the at least two discrete processing tools is capable of independent operation and removable in a discrete fashion relative to other discrete processing tools;
• introducing a glass substrate into the cleanspace fabricator;
• attaching the glass substrate to a metallic case;
• adding an integrated circuit upon a layer supported upon the glass substrate;
• adding an energization element upon a layer supported upon the glass substrate;
• forming a touchscreen device within the cleanspace fabricator from processing of a semiconductor substrate and the glass substrate;
• introducing electronic switches and electronic interconnects into the cleanspace fabricator;
• and wherein the cleanspace fabricator operates without humans occupying any portion of the cleanspace.