# US 2016/0355709 A1 · Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2016/0355709 A1 - Document ID: US20160355709A1 - Status: Published application - Kind: A1 - Application number: 15/114,983 - Filed: 2015-01-29 - Published: 2016-12-08 - Earliest claimed: 2014-01-29 - Assignees: Hitachi Chemical Company, Ltd. - Applicants: Hitachi Chemical Company, Ltd. - Inventors: Sadaaki KATOU; Mika KIMURA; Aya IKEDA; Shinjiro FUJII - Web page: https://patentgrep.com/patent/US20160355709A1 ## CPC - C09J 133/14: of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen - C08F 220/1804: {C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate} - C08F 220/34: Esters containing nitrogen {, e.g. N,N-dimethylaminoethyl (meth)acrylate} - C09J 4/06: {Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond} in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00 - C09J 133/06: of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical - H10F 39/026: {Wafer-level processing} - H10F 39/199: {Back-illuminated image sensors} - H10F 39/804: {Containers or encapsulations} - C08F 220/1811: {C10or C11-(Meth)acrylate, e.g. isodecyl (meth)acrylate, isobornyl (meth)acrylate or 2-naphthyl (meth)acrylate} - C08F 220/325: {containing glycidyl radical, e.g. glycidyl (meth)acrylate} - H10F 39/8063: {Microlenses} - H10W 72/0198: {batch processes} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - C08F: MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A resin composition comprising (a) an acrylic polymer, (b) a compound having at least one (meth)acryloyl group and (c) a polymerization initiator, in which the absolute value of refractive index difference between the component (a) an acrylic polymer and the component (b) having at least one (meth)acryloyl group at 100° C. is 0.031 or less. ## Claims ### Claim 1 A resin composition comprising: (a) an acrylic polymer, (b) a compound having at least one (meth)acryloyl group, and (c) a polymerization initiator, wherein an absolute value of refractive index difference between the (a) acrylic polymer and the (b) compound having at least one (meth)acryloyl group at 100° C. is 0.031 or less. ### Claim 2 (depends on 1) The resin composition according to claim 1, further comprising (d) an antioxidant. ### Claim 3 (depends on 1) The resin composition according to claim 1, wherein the (a) acrylic polymer contains at least one type of structural unit represented by the following formula (I) where A represents an alicyclic group having 5 to 22 carbon atoms optionally having a substituent; and R represents a hydrogen atom or a methyl group. ### Claim 4 (depends on 1) The resin composition according to claim 1, wherein the (a) acrylic polymer contains at least one type of structural unit represented by the following formula (II) where Y represents a linear or branched alkyl group having 1 to 10 carbon atoms optionally having a substituent; and R represents a hydrogen atom or a methyl group. ### Claim 5 (depends on 1) The resin composition according to claim 1, wherein the (a) acrylic polymer contains at least one type of structural unit represented by the following formula (III) where Z represents a group containing at least one functional group selected from the group consisting of a carboxyl group, a hydroxyl group, an acid anhydride group, an amino group, an amide group, an epoxy group and a nitrile group; and R represents a hydrogen atom or a methyl group. ### Claim 6 (depends on 1) The resin composition according to claim 1, for use in optical parts. ### Claim 7 (depends on 1) A method for manufacturing a semiconductor device comprising: a step of forming an adhesive layer of the resin composition according to claim 1 on a semiconductor substrate, a step of sandwiching the adhesive layer between the semiconductor substrate and a transparent substrate, and applying pressure onto the semiconductor substrate and the transparent substrate for bonding, and a step of curing the adhesive layer. ### Claim 8 (depends on 1) A solid-state imaging element comprising: a semiconductor substrate having a light receiving section provided on the upper surface, an adhesive layer provided on the semiconductor substrate so as to cover the light receiving section, and a transparent substrate bonded to the semiconductor substrate by the adhesive layer, wherein the adhesive layer is formed of the resin composition according to claim 1. ### Claim 9 (depends on 2) The resin composition according to claim 2, wherein the (a) acrylic polymer contains at least one type of structural unit represented by the following formula (I) where A represents an alicyclic group having 5 to 22 carbon atoms optionally having a substituent; and R represents a hydrogen atom or a methyl group. ### Claim 10 (depends on 2) The resin composition according to claim 2, wherein the (a) acrylic polymer contains at least one type of structural unit represented by the following formula (II) where Y represents a linear or branched alkyl group having 1 to 10 carbon atoms optionally having a substituent; and R represents a hydrogen atom or a methyl group. ### Claim 11 (depends on 3) The resin composition according to claim 3, wherein the (a) acrylic polymer contains at least one type of structural unit represented by the following formula (II) where Y represents a linear or branched alkyl group having 1 to 10 carbon atoms optionally having a substituent; and R represents a hydrogen atom or a methyl group. ### Claim 12 (depends on 2) The resin composition according to claim 2, wherein the (a) acrylic polymer contains at least one type of structural unit represented by the following formula (III) where Z represents a group containing at least one functional group selected from the group consisting of a carboxyl group, a hydroxyl group, an acid anhydride group, an amino group, an amide group, an epoxy group and a nitrile group; and R represents a hydrogen atom or a methyl group. ### Claim 13 (depends on 3) The resin composition according to claim 3, wherein the (a) acrylic polymer contains at least one type of structural unit represented by the following formula (III) where Z represents a group containing at least one functional group selected from the group consisting of a carboxyl group, a hydroxyl group, an acid anhydride group, an amino group, an amide group, an epoxy group and a nitrile group; and R represents a hydrogen atom or a methyl group. ### Claim 14 (depends on 4) The resin composition according to claim 4, wherein the (a) acrylic polymer contains at least one type of structural unit represented by the following formula (III) where Z represents a group containing at least one functional group selected from the group consisting of a carboxyl group, a hydroxyl group, an acid anhydride group, an amino group, an amide group, an epoxy group and a nitrile group; and R represents a hydrogen atom or a methyl group. ### Claim 15 (depends on 2) A solid-state imaging element comprising: a semiconductor substrate having a light receiving section provided on the upper surface, an adhesive layer provided on the semiconductor substrate so as to cover the light receiving section, and a transparent substrate bonded to the semiconductor substrate by the adhesive layer, wherein the adhesive layer is formed of the resin composition according to claim 2. ### Claim 16 (depends on 3) A solid-state imaging element comprising: a semiconductor substrate having a light receiving section provided on the upper surface, an adhesive layer provided on the semiconductor substrate so as to cover the light receiving section, and a transparent substrate bonded to the semiconductor substrate by the adhesive layer, wherein the adhesive layer is formed of the resin composition according to claim 3. ### Claim 17 (depends on 4) A solid-state imaging element comprising: a semiconductor substrate having a light receiving section provided on the upper surface, an adhesive layer provided on the semiconductor substrate so as to cover the light receiving section, and a transparent substrate bonded to the semiconductor substrate by the adhesive layer, wherein the adhesive layer is formed of the resin composition according to claim 4. ### Claim 18 (depends on 5) A solid-state imaging element comprising: a semiconductor substrate having a light receiving section provided on the upper surface, an adhesive layer provided on the semiconductor substrate so as to cover the light receiving section, and a transparent substrate bonded to the semiconductor substrate by the adhesive layer, wherein the adhesive layer is formed of the resin composition according to claim 5.