# US 2016/0355703 A1 · Masking pressure-sensitive adhesive tape

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- Number: US 2016/0355703 A1
- Document ID: US20160355703A1
- Status: Published application
- Kind: A1
- Application number: 15/147,044
- Filed: 2016-05-05
- Published: 2016-12-08
- Earliest claimed: 2015-06-03
- Assignees: Nitto Denko Corporation
- Applicants: Nitto Denko Corporation
- Inventors: Yuji OKAWA
- Web page: https://patentgrep.com/patent/US20160355703A1

## CPC

- C09J 133/068: {containing glycidyl groups}
- C09D 183/08: containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
- C09J 7/38: Pressure-sensitive adhesives [PSA]
- C09J 133/02: Homopolymers or copolymers of acids; Metal or ammonium salts thereof
- C08G 77/28: sulfur-containing groups
- C08L 2312/00: Crosslinking
- C09J 133/08: Homopolymers or copolymers of acrylic acid esters
- C09J 183/04: Polysiloxanes
- C09J 2203/326: for bonding electronic components such as wafers, chips or semiconductors
- C09J 2301/122: the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
- C09J 2433/00: Presence of (meth)acrylic polymer
- C09J 2483/00: Presence of polysiloxane
- Y10T 428/24959: of adhesive layers
- Y10T 428/28: Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T 428/2891: including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

Provided is a masking pressure-sensitive adhesive tape to be used in formation of a metal layer by a vacuum film formation method on part of a surface of an electronic part, which may prevent formation of a metal layer, by the vacuum film formation method, on a surface masked by the masking pressure-sensitive adhesive tape. The masking pressure-sensitive adhesive tape includes: a base material; and a pressure-sensitive adhesive layer arranged on one side of the base material, in which the pressure-sensitive adhesive layer has a thickness of 5 μm or more, and the masking pressure-sensitive adhesive tape has a 180° peeling adhesive strength at 23° C. with respect to a stainless-steel plate of 0.4 N/20 mm or more.

## Claims

### Claim 1

A masking pressure-sensitive adhesive tape to be used in formation of a metal layer by a vacuum film formation method on part of a surface of an electronic part,
the masking pressure-sensitive adhesive tape comprising:
a base material; and
a pressure-sensitive adhesive layer arranged on one side of the base material,
wherein the pressure-sensitive adhesive layer has a thickness of 5 μm or more, and
wherein the masking pressure-sensitive adhesive tape has a 180° peeling adhesive strength at 23° C. with respect to a stainless-steel plate of 0.4 N/20 mm or more.

### Claim 2 (depends on 1)

The masking pressure-sensitive adhesive tape according to claim 1, wherein the electronic part has an uneven surface, and the masking pressure-sensitive adhesive tape is used by being bonded onto the uneven surface.

### Claim 3 (depends on 1)

The masking pressure-sensitive adhesive tape according to claim 1, wherein the masking pressure-sensitive adhesive tape has a 180° peeling adhesive strength at 23° C. with respect to a stainless-steel plate of 10 N/20 mm or less after the masking pressure-sensitive adhesive tape is bonded onto the stainless-steel plate and left to stand at 200° C. for 1 hour.

### Claim 4 (depends on 1)

A method of producing an electronic part, comprising using the masking pressure-sensitive adhesive tape of claim 1.