# US 2016/0355013 A1 · Liquid discharge head and method for producing liquid discharge head

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- Number: US 2016/0355013 A1
- Document ID: US20160355013A1
- Status: Published application
- Kind: A1
- Application number: 15/170,747
- Filed: 2016-06-01
- Published: 2016-12-08
- Earliest claimed: 2015-06-05
- Assignees: Canon Kabushiki Kaisha
- Applicants: Canon Kabushiki Kaisha
- Inventors: Yuzuru Ishida; Yoshinori Misumi; Maki Kato; Norihiro Yoshinari; Akio Goto; Takahiro Matsui
- Web page: https://patentgrep.com/patent/US20160355013A1

## CPC

- B41J 2/335: Structure of thermal heads
- B41J 2/14129: {Layer structure}
- B41J 2/1603: {of the front shooter type}
- B41J 2/1628: {dry etching}
- B41J 2/1631: {photolithography}
- B41J 2/1642: {thin film formation by CVD [chemical vapor deposition]}
- B41J 2/1646: {thin film formation by sputtering}
- G03F 7/00: Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor (using photoresist structures for special production processes, see the relevant places, e.g. B44C, H10P76/00, H05K)
- H10P 50/268: {of silicon-containing layers}
- H10P 95/00: Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- B41J 2/1433: {Structure of nozzle plates}
- B41J 2/162: {Manufacturing of the nozzle plates}
- B41J 2/1626: {etching}
- C23F 1/00: Etching metallic material by chemical means (manufacture of printing surfaces B41C; manufacture of printed circuits H05K)
- C23F 4/00: Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
- G03F 7/16: Coating processes; Apparatus therefor (applying coatings to base materials in general B05; applying photosensitive compositions to base for photographic purposes G03C1/74)
- B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- C23F: NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE (working metal by laser beams B23K26/00; desurfacing by applying flames B23K7/00; working of metal by electro-erosion B23H; producing decorative effects by removing surface material, e.g. by engraving, by etching, B44C1/22; electrolytic etching or polishing C25F); INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25

## Abstract

A liquid discharge head has a chamber wall member forming a liquid chamber and a discharge head substrate containing a laminate of a base substrate having a surface for an element generating energy for discharging liquid. A first and second layer is formed contacting the wall. The second layer has adhesiveness with the chamber wall member higher than adhesiveness of the first layer, forming the liquid chamber with the chamber wall member. The first layer has a portion exposed from the second layer as viewed from a first direction orthogonal to the surface and contacting the chamber wail member at a position distant from the liquid chamber in a second direction orthogonal to the inner surface of the wall relative to a portion where the wall and second layer contact, and the length in the second direction of the portion of the first layer is 0.3 μm or more.

## Claims

### Claim 1

A liquid discharge head comprising:
a liquid chamber wall member having a wall forming a liquid chamber storing liquid; and
a liquid discharge head substrate containing a laminate of a base substrate having a surface on which an element generating energy for discharging liquid is formed,
a first layer, and
a second layer disposed on the first layer, contacting the wall, and having adhesiveness with the liquid chamber wail member higher than the adhesiveness of the first layer, and
forming the liquid chamber with the liquid chamber wall member, wherein
the first layer has a portion exposed from the second layer as viewed from a first direction orthogonal to the surface and contacting the liquid chamber wall member at a position distant from the liquid chamber in a second direction orthogonal to an inner surface of the wall relative to a portion where the wall and the second layer contact, and
a length in the second direction of the portion of the first layer is 0.3 μm or more.

### Claim 2 (depends on 1)

The liquid discharge head according to claim 1, wherein the length is 2.0 μm or less.

### Claim 3 (depends on 2)

The liquid discharge head according to claim 2, wherein the portion inclines at an angle of 45° or less in a cross section with respect to the first direction.

### Claim 4 (depends on 1)

The liquid discharge head according to claim 1, wherein the first layer contains, a plurality of layers and the portion contains the plurality of layers.

### Claim 5 (depends on 4)

The liquid discharge head according to claim 4, wherein the plurality of layers are different in the adhesiveness with the liquid chamber wall member.

### Claim 6 (depends on 1)

The liquid discharge head according to claim 1, wherein the first layer has a layer containing precious metal elements or alloys of the precious metal elements.

### Claim 7 (depends on 1)

The liquid discharge head according to claim 1, wherein the second layer contains silicon.

### Claim 8 (depends on 1)

The liquid discharge head according to claim 1, wherein
the first layer has a third layer and a fourth layer disposed on both surfaces of the third layer and having the adhesiveness with the liquid chamber wall member higher than the adhesiveness of the third layer, and
the portion contains the third layer and the fourth layers.

### Claim 9 (depends on 1)

The liquid discharge head according to claim 1, wherein the first layer is a protective layer covering the element.

### Claim 10 (depends on 1)

A method for producing the liquid discharge head according to claim 1, comprising:
etching the second layer using a mask; and
etching the first layer using the mask.