Embedded optics in modular assemblies

An enhanced bonding method, the method comprising the steps of:

• (a) dispensing a high-wettability adhesive into a module fixture populated with a plurality of battery cells wherein the module fixture provides a plurality of bonding wells with each bonding well accepting a first portion of one or more of the plurality of battery cells with the module fixture including one or more apertures communicated with one or more of the plurality of bonding wells, the high-wettability adhesive being selectively curable upon application of an ultraviolet (UV) radiation field;
• (b) applying the UV radiation field generally uniformly to the module fixture;
• and
• (c) concentrating the generally uniformly applied curing modality into a plurality of target zones corresponding to the plurality of bonding wells using a fixture enhancement structure integrated into the module fixture that optically concentrates the UV radiation field towards the plurality of target zones.