Method for electrolytic surface modification of flat metal workpieces in copper-sulfate treatment liquid containing sulfate-metallates
AssigneeSchlenk Metallfolien GmbH & Co. KG
InventorsFabian DISTELRATH, Thomas BOOZ, Andreas SEIDEL
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Abstract
The invention relates to a method for the electrolytic surface modification of a flat workpiece by the deposition of copper aggregates. The invention also relates to flat metal workpieces that can be produced using this method and to the use of said metal workpieces as substrates for the formation of secure adhesive bonds comprising a plurality of materials.
Claims24
1-13. (canceled)
A method for the electrolytic surface modification of a flat metal workpiece, comprising;
- (a) anodically polarizing at least one surface of the flat metal workpiece with a treatment liquid, whereby an anodic dissolving process is induced, and then
- (b) cathodically polarizing said at least one surface of the flat metal workpiece with the treatment liquid, thereby inducing a cathodic deposition for the deposition of one or more metals on the at least one surface of the flat metal workpiece,
- wherein said treatment liquid is comprised of a conductive liquid based on sulphuric acid/sulphate solutions of copper and one or more members selected from the group consisting of yttrium, lanthanum and lanthanoids, wherein the ratio between (i) the sum of the amount-of-substance fractions of yttrium, lanthanum and/or the lanthanoids, where contained, and (ii) the amount-of-substance fraction of copper is at least 0.0182.
A flat metal workpiece upon which is deposited on the surface thereof metal aggregates in the form of balls covered with vertical lamellae, said surface having average roughness values Ra and Rz values, as determined in accordance with DIN EN ISO 4288:1998, ranging from 0.22 to 0.32 μm and 1.4 to 2.1 μm, respectively.
Dependencies are inferred from the claim text.