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US 2016/0313641 A1Published application
Photosensitive polyimide compositions
OwnerBinod B. De, Sanjay Malik +4inventors
InventorsBinod B. De, Sanjay Malik, Raj Sakamuri, William A. Reinerth, Ognian N. Dimov, Ahmad A. Naiini
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Abstract
This disclosure relates to a dry film structure that includes a carrier substrate, and a polymeric layer supported by the carrier substrate. The polymeric layer includes at least one fully imidized polyimide polymer.
Claims40
A dry film structure, comprising:
- a carrier substrate;
- and
- a photosensitive polymeric layer supported by the carrier substrate;
- the photosensitive polymeric layer comprises at least one fully imidized polyimide polymer;
- wherein the photosensitive polymeric layer has a film thickness of at most about 5 microns.
2 more elements
A process for preparation of a dry film structure, comprising:
- (a) coating a carrier substrate with a photosensitive polymeric composition to form a coated composition;
- (b) drying the coated composition to form a photosensitive polymeric layer;
- and
- (c) optionally applying a protective layer to the photosensitive polymeric layer to form a dry film structure;
- wherein the photosensitive polymeric layer has a film thickness of at most about 5 microns.
2 more elements
A process of forming a patterned film, comprising:
- (a) providing a dry film structure comprising:
- a carrier substrate;
- a protective layer;
- and
- a photosensitive polymeric layer between the carrier substrate and the protective layer, wherein the photosensitive polymeric layer has a film thickness of at most about 5 microns;
- (b) removing the protective layer from the dry film structure;
- (c) applying the structure obtained in step (b) onto an electronic substrate to form a laminate, the laminate comprising the photosensitive polymeric layer between the electronic substrate and the carrier substrate;
- and
- (d) converting the photosensitive polymeric layer into a patterned layer, thereby forming a patterned film comprising the patterned layer;
- wherein the patterned layer has a thickness of at most about 5 microns and comprises at least one element having a feature size of at most about 3 microns.
7 more elements
Dependencies are inferred from the claim text.