Multilayer transformer pcb structure for electric car and method for manufacturing multilayer transformer pcb for the same

A method of manufacturing a multilayer transformer PCB for an electric car, comprising:

• a first step of cutting a source material of a transformer PCB for inner layers in a given standard size and constituting an inner layer circuit through a conductive patterning process including a photosensitive film process;
• a second step of performing a black oxide process on the transformer PCB for inner layers having the inner layer circuit constituted therein after the first step;
• a third step of performing a lamination process by laminating a source material of an outer layer for an outer layer process on a top surface of the transformer PCB for inner layers having the inner layer circuit formed therein after the second step;
• a step process of cutting the source material of the outer layer laminated on the top surface of the transformer PCB for inner layers in a given standard size and constituting an outer layer circuit through a conductive patterning process including a photosensitive film process after the third step;
• a fifth step of forming a PSR-printed layer coated with a PSR ink while changing the 1st to 5th printing directions on a top surface of the outer layer circuit in a state in which the outer layer circuit is stacked on a top surface of the transformer PCB for inner layers having the inner layer circuit formed therein by means of the first process to the fourth step;
• and
• a sixth step of performing gold plating on the top surface of the transformer PCB having the PSR-printed layer formed therein, marking, and appearance processing, mounting various parts on the transformer PCB, and covering a case to finish the transformer PCB for an electric car after the fifth step
• wherein the first step further comprises:
• an inner layer circuit connection operation of horizontally forming first and second connecting copper tabs in plural on both surfaces of a base substrate of the transformer PCB using a copper (Cu) material so that the copper (Cu) material has a thickness of 10 oz (360 μm), and connecting battery cells to inner layer circuits, the fourth step further comprises:
• an outer layer circuit connection operation of horizontally forming third and fourth connecting copper tabs in plural on a source material of the outer layers laminated on both top surfaces of the transformer PCB for inner layers using a copper (Cu) material so that the copper (Cu) material has a thickness of 10 oz (360 μm), and connecting the battery cells to outer layer circuits, and the sixth step further comprises:
• a plating operation of plating top surfaces of the first to fourth connecting copper tabs with nickel (Ni) and gold (Au) at thicknesses of 3 to 5 μm and 0.03 to 0.05 μm, respectively, to enhance current efficiency of a part insertion hole.