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US 2016/0271708 A1Published application
Methods and apparatus for cutting profiles
AssigneeSeoul Laser Dieboard System Co., Ltd.
InventorSang Moo Lee
Life of this patent
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Abstract
An apparatus for cutting a profile, including: a cutter configured to make cuts on the profile having a first surface and a second surface, and having at least one rib on the first surface, wherein the cuts are made on the first surface of the profile; a first drive unit to drive the cutter forward and backward to and from the first surface of the profile; and a second drive unit to drive the cutter up and down along the first surface of the profile.
Claims1
An apparatus for cutting a profile, comprising:
- a cutter configured to make cuts on the profile having a first surface and a second surface, and having at least one rib on the first surface, wherein the cuts are made on the first surface of the profile;
- a first drive unit to drive said cutter forward and backward to and from the first surface of the profile;
- and a second drive unit to drive said cutter up and down along the first surface of the profile.
Dependencies are inferred from the claim text.