# US 2016/0262292 A1 · Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2016/0262292 A1 - Document ID: US20160262292A1 - Status: Published application - Kind: A1 - Application number: 15/061,233 - Filed: 2016-03-04 - Published: 2016-09-08 - Earliest claimed: 2015-03-06 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Keon KUK; Young-dae KO; O-hyun BEAK; Eun-bong HAN; Hyeon-hyang KIM; Yeon-kyoung JUNG; Il-ju MUN - Web page: https://patentgrep.com/patent/US20160262292A1 ## CPC - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - B05B 15/20: Arrangements for agitating the material to be sprayed, e.g. for stirring, mixing or homogenising - H05K 1/0218: {by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence)} - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H10W 42/284: {shielding resins} - H10W 76/47: Solid or gel fillings - H05K 2201/0715: provided by an outer layer of PCB - H05K 2203/0126: Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes - H05K 2203/1316: Moulded encapsulation of mounted components - H10W 70/65: Shapes or dispositions of interconnections - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - B05B: SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES (spray-mixers with nozzles B01F25/72; processes for applying liquids or other fluent materials to surfaces by spraying B05D) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface of the insulating layer, and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer. ## Claims ### Claim 1 A circuit element package comprising: a circuit element disposed on a printed circuit board; an insulating layer covering the circuit element; a first shielding layer covering a side surface of the insulating layer; and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer. ### Claim 2 (depends on 1) The circuit element package as claimed in claim 1, wherein the first shielding layer comprises an electromagnetic shielding material having a viscosity greater than a viscosity of the insulating layer. ### Claim 3 (depends on 1) The circuit element package as claimed in claim 1, further comprising an edge bridge electrically connecting the first shielding layer to the second shielding layer. ### Claim 4 (depends on 3) The circuit element package as claimed in claim 3, wherein the second shielding layer is disposed on an upper surface of the insulating layer and an upper surface of the edge bridge. ### Claim 5 (depends on 1) The circuit element package as claimed in claim 1, further comprising: an epoxy underfill through which the circuit element is disposed on the printed circuit board; and gas discharge holes disposed in portions of the first shielding layer and discharging gas that is generated by the epoxy underfill. ### Claim 6 (depends on 1) The circuit element package as claimed in claim 1, further comprising: a ground pad disposed on the printed circuit board; and a skirt portion disposed on an upper surface of the ground pad, wherein the first shielding layer is disposed on an upper surface of the skirt portion. ### Claim 7 (depends on 1) The circuit element package as claimed in claim 1, further comprising an insulating adhesive layer disposed on a bottom surface of the second shielding layer and covering the circuit element having a height greater than a height of the insulating layer. ### Claim 8 (depends on 1) The circuit element package as claimed in claim 1, wherein the insulating layer comprises an insulating mold having an open bottom surface and a space disposed in the insulating mold. ### Claim 9 (depends on 1) The circuit element package as claimed in claim 1, wherein the insulating layer is disposed on a bottom surface of the second shielding layer, and an air gap is disposed inside the first shielding layer. ### Claim 10 (depends on 1) The circuit element package as claimed in claim 1, wherein the second shielding layer comprises through-holes disposed along sides of the second shielding layer, and the circuit element package further comprises a connection layer disposed along a circumferential portion of an upper surface of the second shielding layer on which the through-holes are disposed, disposed in the through-holes, and electrically connecting the first shielding layer to the second shielding layer. ### Claim 11 A method of manufacturing a circuit element package, the method comprising: forming a circuit element on a printed circuit board; forming an insulating layer covering the circuit element; and forming a shielding layer covering the insulating layer, wherein the shielding layer comprises: a first shielding layer covering a side surface of the insulating layer; and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer. ### Claim 12 (depends on 11) The method as claimed in claim 11, wherein the forming the insulating layer comprises: injecting the insulating layer in the first shielding layer; and curing the insulating layer. ### Claim 13 (depends on 11) The method as claimed in claim 11, wherein the forming the shielding layer comprises forming simultaneously an upper portion and a lower portion of the first shielding layer. ### Claim 14 (depends on 11) The method as claimed in claim 11, further comprising: varying a temperature of a material of the insulating layer or vibrate the material of the insulating layer before the forming the insulating layer to vary a viscosity of the material of the insulating layer; and varying a temperature of a material of the shielding layer or vibrate the material of the shielding layer before the forming the shielding layer to vary a viscosity of the material of the shielding layer. ### Claim 15 (depends on 11) The method as claimed in claim 11, further comprising forming an edge bridge electrically connecting the first shielding layer to the second shielding layer in response to the forming the shielding layer. ### Claim 16 An apparatus for manufacturing a circuit element package, the apparatus comprising: a dispenser; a driver configured to move the dispenser; and a controller configured to control the dispenser and the driver, wherein the dispenser comprises: a storage chamber configured to store a material of an insulating layer or a shielding layer; a material viscosity variator configured to vary a viscosity of the stored material; and a nozzle configured to discharge the varied material. ### Claim 17 (depends on 16) The apparatus as claimed in claim 16, wherein the material viscosity variator comprises a vibrator disposed in the storage chamber and configured to vibrate the stored material, and the controller is further configured to control the vibrator to apply a shear stress to the material using a thixotropy of the material to vary the viscosity of the material. ### Claim 18 (depends on 16) The apparatus as claimed in claim 16, wherein the nozzle comprises: a first discharger disposed on a side surface of the nozzle and having a height greater than a width of the first discharger; and a second discharger disposed on a lower end of the nozzle and configured to communicate with the first discharger. ### Claim 19 (depends on 16) The apparatus as claimed in claim 16, wherein the nozzle comprises: an upper discharge port disposed on a side surface of the nozzle; and a lower discharge port disposed on the side surface of the nozzle, disposed on a lower side of the upper discharge port, and disposed forward the upper discharge port. ### Claim 20 (depends on 16) The apparatus as claimed in claim 16, wherein the nozzle comprises three or more discharge ports on a side surface of the nozzle in upward and downward directions.