# US 2016/0260656 A1 · Electronic package structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2016/0260656 A1 - Document ID: US20160260656A1 - Status: Published application - Kind: A1 - Application number: 14/984,554 - Filed: 2015-12-30 - Published: 2016-09-08 - Earliest claimed: 2015-03-03 - Assignees: Amkor Technology, Inc. - Applicants: Amkor Technology, Inc. - Inventors: Tae Kyung Hwang; Eun Sook Sohn; Won Joon Kang; Gi Jeong Kim - Web page: https://patentgrep.com/patent/US20160260656A1 ## CPC - H10W 70/411: {Chip-supporting parts, e.g. die pads} - H10W 70/421: {Shapes or dispositions} - H10W 70/424: {Cross-sectional shapes (H10W70/481 takes precedence)} - H10W 70/479: {on or in insulating or insulated package substrates, interposers, or redistribution layers} - H10W 74/111: {the semiconductor body being completely enclosed} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10W 90/726: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An electronic package includes a lead frame structure having one or more structural features configured to improve board level reliability. In one embodiment, the structural feature comprises lead frame protrusions extending outward from the electronic package, which are configured to laterally engage solder structures used to attach the electronic package to a next level of assembly. In another embodiment, conductive bumps are attached to exposed portions of the lead frame in advance of next level assembly processes. In a further embodiment, the lead frame comprises laterally separated contact points for attaching an electron die and for attaching the electronic package to a next level of assembly. ## Claims ### Claim 1 An electronic package structure comprising: a substrate comprising: a die pad having die pad top surface and an opposing die pad bottom surface, wherein the die pad comprises a conductive material; a plurality of leads laterally spaced apart from the die pad; and a substrate encapsulant interposed between the die pad and the plurality of leads, wherein the substrate encapsulant has a substrate top surface and an opposing substrate bottom surface, and wherein the die pad and the plurality of leads protrude outward from the substrate bottom surface; an electronic die electrically coupled to the die pad and the plurality of leads; and a package body encapsulating the electronic die and the substrate top surface, wherein the substrate bottom surface is exposed to the outside. ### Claim 2 (depends on 1) The structure of claim 1, wherein the die pad bottom surface comprises a continuous and substantially planar surface. ### Claim 3 (depends on 1) The structure of claim 1, wherein the die pad bottom surface and the bottom surfaces of the leads protrude outward a distance of less than about 10 microns from the substrate bottom surface. ### Claim 4 (depends on 1) The structure of claim 1 further comprising a circuit board electrically connected to the substrate through solder structures and having a circuit pattern formed thereon. ### Claim 5 (depends on 4) The structure of claim 4, wherein: the die pad bottom surface comprises a continuous and substantially planar surface; a first solder structure electrically connects the die pad bottom surface to a first portion the circuit pattern; and a second solder structure electrically connects a lead to a second portion of the circuit pattern, wherein the first solder structure has a greater width than the second solder structure. ### Claim 6 (depends on 5) The structure of claim 5, wherein the first solder structure extends entirely across the die pad bottom surface. ### Claim 7 (depends on 4) The structure of claim 4, wherein: a first solder structure surrounds vertical side surfaces of the die pad protruding from the substrate bottom surface; and a second solder structure surrounds vertical side surfaces of one of the plurality of leads protruding from the substrate bottom surface. ### Claim 8 (depends on 4) The structure of claim 4, wherein the plurality of leads comprises: a first lead portion exposed to the outside of the substrate bottom surface and attached to the circuit pattern at a first connection point; and a second lead portion laterally extending towards the die pad and having a recessed bottom surface encapsulated by the substrate encapsulant, and wherein a conductive pad on the electronic die is attached to the second lead portion at a second connection point, and wherein the first connection point is laterally separated from the second connection point, and wherein the electronic die overlaps the second connection point but not the first connection point. ### Claim 9 (depends on 1) The structure of claim 1, wherein: the electronic die comprises a plurality of conductive pads on a major surface; the plurality of conductive pads are electrically coupled to the plurality of leads and the die pad with conductive bumps; and more than one conductive bump connects the electronic die to the die pad. ### Claim 10 An electronic package structure comprising: a substrate comprising: a die pad having die pad top surface and an opposing die pad bottom surface, wherein the die pad comprises a conductive material; a plurality of leads laterally spaced apart from the die pad each lead having a lead top surface and an opposing lead bottom surface; a substrate encapsulant interposed between the die pad and the plurality of leads, wherein the substrate encapsulant has a substrate top surface and an opposing substrate bottom surface; an electronic die electrically coupled to the die pad and the plurality of leads; and a package body encapsulating the electronic die and the substrate top surface, wherein the substrate bottom surface is exposed to the outside, and wherein the substrate further comprises one or more structural features configured to improve board-level reliability, the one or more features comprising one or more of: the die pad and the plurality of leads configured to protrude outward from the substrate bottom surface such that side surfaces of the die pad and the plurality of leads are exposed to the outside, conductive bumps disposed on the die pad bottom surface and the lead bottom surfaces, or at least one lead comprising: a first lead portion exposed to the outside of the substrate bottom surface and defining a first connection point for attaching the electronic package structure to a next level of assembly; and a second lead portion laterally extending towards the die pad and having a recessed bottom surface encapsulated by the substrate encapsulant, the second lead portion defining a second connection point for attaching to the electronic die, wherein the first connection point is laterally separated from the second connection point. ### Claim 11 (depends on 10) The structure of claim 10, wherein the one or more features includes the conductive bumps, and wherein the die pad bottom surface comprises a plurality of pad portions separated by a recess encapsulated by the substrate encapsulant. ### Claim 12 (depends on 11) The structure of claim 11, wherein the die pad bottom surface and lead bottom surfaces are substantially co-planar with the substrate bottom surface, and wherein a conductive bump is disposed on each pad portion. ### Claim 13 (depends on 10) The structure of claim 10, wherein the one or more features includes the die pad and the plurality of leads configured to protrude outward from the substrate bottom surface, and wherein the die pad bottom surface comprises a continuous and substantially planar surface. ### Claim 14 (depends on 10) The structure of claim 10, wherein the one or more features includes the at least one lead comprising the first lead portion and the second lead portion, wherein a conductive pad on the electronic die is attached to the second lead portion at the second connection point, and wherein the electronic die overlaps the second connection point but not the first connection point. ### Claim 15 (depends on 10) The structure of claim 10, wherein: the electronic die comprises a plurality of conductive pads on a major surface; the plurality of conductive pads are electrically coupled to the plurality of leads and the die pad with conductive bumps; and more than one conductive bump connects the electronic die to the die pad. ### Claim 16 An electronic package structure comprising: a substrate including a die pad and a plurality of leads spaced apart from the die pad; an electronic die electrically connected to the die pad and the plurality of leads; and an encapsulant structure encapsulating the substrate and the electronic die, wherein a bottom surface of the die pad and bottom surfaces of the plurality of leads are exposed to the outside, wherein the electronic die is attached to first portions of the plurality of leads to define first connection points, and wherein the plurality of leads comprise second portions attached to the first portions, wherein the second portions are configured to define second connection points for attaching to a next level of assembly, and wherein the first connection points and the second connection points are laterally separated. ### Claim 17 (depends on 16) The structure of claim 16, wherein the first portions of the plurality of leads are enclosed within the encapsulant, and wherein the second portions are angled with respect to the first portions, and wherein at least one second portion has a larger width than another second portion. ### Claim 18 (depends on 16) The structure of claim 16, wherein the substrate further comprises a substrate encapsulant interposed between the die pad and the plurality of leads, and wherein the substrate encapsulant has a substrate top surface and an opposing substrate bottom surface, and wherein the die pad bottom surface and the bottom surfaces of the leads are exposed in the substrate bottom surface. ### Claim 19 (depends on 18) The structure of claim 18, wherein the die pad bottom surface and the bottom surfaces of the leads protrude outward from the substrate bottom surface to provide lateral surfaces configured to engage solder structures along side surfaces of the die pad and leads. ### Claim 20 (depends on 19) The structure of claim 19, wherein the die pad bottom surface comprises a continuous and substantially planar surface.