# US 2016/0259252 A1 · Spatial light modulation element module, photolithographing apparatus, exposure apparatus, method of manufacturing spatial light modulation element module and method of manufacturing device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2016/0259252 A1 - Document ID: US20160259252A1 - Status: Published application - Kind: A1 - Application number: 15/155,453 - Filed: 2016-05-16 - Published: 2016-09-08 - Earliest claimed: 2013-11-18 - Assignees: Nikon Corporation - Applicants: Nikon Corporation - Inventors: Yoshihiko SUZUKI; Junji SUZUKI - Web page: https://patentgrep.com/patent/US20160259252A1 ## CPC - G03F 7/70191: {Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like} - B81C 1/00317: {Packaging optical devices} - B81C 3/005: {Passive alignment, i.e. without a detection of the position of the elements or using only structural arrangements or thermodynamic forces} - G02B 26/02: for controlling the intensity of light {(G02B26/004 takes precedence)} - G02B 26/06: for controlling the phase of light (G02B26/08 takes precedence {, measuring optical phase difference G01J9/00}) - G02B 26/0833: {the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD (G02B26/0825 takes precedence; micromechanical devices in general B81B)} - G02B 26/0841: {the reflecting element being moved or deformed by electrostatic means} - G03F 7/70291: {Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices} - B81B 2201/042: Micromirrors, not used as optical switches - B81B 2207/012: the micromechanical device and the control or processing electronics being separate parts in the same package - B81C 2203/054: using structural alignment aids, e.g. spacers, interposers, male/female parts, rods or balls - G02B 5/003: {Light absorbing elements} - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) ## Abstract A spatial light modulation element module having a large area is manufactured. A spatial light modulation element module comprising a base member and a plurality of spatial light modulation element arrays, wherein each of the plurality of spatial light modulation element arrays has a light modulation element which modulates and emits at least one of the intensity and the phase of an incident light, and the base member maintains the plurality of spatial light modulation element arrays in a predetermined relative position in a bare chip state. In the above-described spatial light modulation element module, the plurality of spatial light modulation element arrays may be in a staggered arrangement in at least 1 direction. ## Claims ### Claim 1 A spatial light modulation element module comprising; a base member; and a plurality of spatial light modulation element arrays; wherein each of the plurality of spatial light modulation element arrays has a light modulation element which modulates and emits at least one of an intensity and a phase of an incident light, and the base member maintains the plurality of spatial light modulation element arrays in predetermined relative positions in bare chip states. ### Claim 2 (depends on 1) The spatial light modulation element module according to claim 1, wherein the plurality of spatial light modulation element arrays are in a staggered arrangement in at least one direction. ### Claim 3 (depends on 2) The spatial light modulation element module according to claim 2, wherein at least one reflecting element of one spatial light modulation element array and at least one reflecting element of another spatial light modulation element array adjacent to the one spatial light modulation element array are arranged in adjacent positions without a space or in an overlapping position, as viewed from a direction orthogonal to the at least one direction. ### Claim 4 (depends on 1) The spatial light modulation element module according to claim 1, comprising, a plurality of combinations of the base member and the plurality of spatial light modulation element arrays, and wherein the combinations are arranged with each other such that the plurality of spatial light modulation element arrays are in a staggered arrangement. ### Claim 5 (depends on 1) The spatial light modulation element module according to claim 1 wherein, each of the plurality of spatial light modulation element arrays has a micro-bump electrically connected to the base member on a surface opposite to the base member. ### Claim 6 (depends on 1) The spatial light modulation element module according to claim 1, further comprising a packaging unit which covers the base member and at least a portion of each of the plurality of spatial light modulation element arrays. ### Claim 7 (depends on 6) The spatial light modulation element module according to claim 6, wherein the packaging unit has a mask unit in which an opening is provided in a region in which each of the plurality of spatial light modulation element arrays is arranged, and the mask unit further has an antireflective structure including an absorber which absorbs an incident light or a reflected light. ### Claim 8 (depends on 6) The spatial light modulation element module according to claim 6, wherein the packaging unit has a mask unit in which an opening is provided in a region in which each of the plurality of spatial light modulation element arrays is arranged, and the mask unit includes any of a mirror, a diffraction grating, and a blazed diffraction optical element and further includes a structure which reflects an incident light toward an optical path which is different from a reflected light from a reflecting element. ### Claim 9 (depends on 1) A photolithographing apparatus to draw a light figure using the spatial light modulation element module according to claim 1. ### Claim 10 (depends on 9) An exposure apparatus to expose a semiconductor using the photolithographing apparatus according to claim 9. ### Claim 11 A method of manufacturing a spatial light modulation element module comprising: a step of preparing a plurality of spatial light modulation element arrays each of which has a plurality of reflecting elements; and a step of arranging each of the plurality of spatial light modulation element arrays along a base member. ### Claim 12 (depends on 11) The method of manufacturing the spatial light modulation element module according to claim 11, wherein a sacrifice layer which fixes a plurality of reflecting elements in each of the plurality of spatial light modulation element arrays is provided in the step of preparing, and the method further comprises a step of removing the sacrifice layer after the step of arranging. ### Claim 13 (depends on 11) The method of manufacturing the spatial light modulation element module according to claim 11, wherein an alignment mark is provided in the base member and each of the plurality of spatial fight modulation element arrays, and the plurality of spatial light modulation element arrays are positioned using the alignment mark in the step of arranging. ### Claim 14 (depends on 11) The method of manufacturing the spatial light modulation element module according to claim 11, wherein the plurality of spatial light modulation element arrays are positioned using a positioning member which is sandwiched between the base member and each of the plurality of spatial light modulation element arrays, in the step of arranging. ### Claim 15 (depends on 14) The method of manufacturing the spatial light modulation element module according to claim 14, wherein the base member and each of the plurality of spatial light modulation element arrays are provided with a groove which receives the positioning member. ### Claim 16 (depends on 10) A method of manufacturing a device including lithography process, wherein exposure is performed using the exposure apparatus according to claim 10 in the lithography process.