# US 2016/0257101 A1 · Electronic device manufacturing method and electronic device

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- Number: US 2016/0257101 A1
- Document ID: US20160257101A1
- Status: Published application
- Kind: A1
- Application number: 15/003,612
- Filed: 2016-01-21
- Published: 2016-09-08
- Earliest claimed: 2015-03-06
- Assignees: Seiko Epson Corporation
- Applicants: Seiko Epson Corporation
- Inventors: Naoya SATO; Masashi YOSHIIKE
- Web page: https://patentgrep.com/patent/US20160257101A1

## CPC

- B32B 7/12: using interposed adhesives or interposed materials with bonding properties
- B32B 3/26: characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids {(foam layer B32B5/18; layer of synthetic resin characterised by fillers that create voids or cavities B32B27/205); characterised by an apertured layer}
- B32B 7/14: applied in spaced arrangements, e.g. in stripes
- B32B 15/02: {Layer formed of wires, e.g. mesh}
- B32B 15/08: of synthetic resin
- B32B 15/18: comprising iron or steel {(B32B15/011, B32B15/012 and B32B15/013 take precedence)}
- B32B 27/08: of synthetic resin
- B32B 27/283: {comprising polysiloxanes}
- B32B 37/1292: {selectively, e.g. in stripes, in patterns (B32B37/0076 takes precedence)}
- B41J 2/161: {of film type, deformed by bending and disposed on a diaphragm}
- B41J 2/1623: {bonding and adhesion}
- G02B 5/00: Optical elements other than lenses (light guides G02B6/00; optical logic elements G02F3/00)
- B32B 2037/1253: {curable adhesive}
- B32B 2255/10: on synthetic resin layer or on natural or synthetic rubber layer
- B32B 2255/20: Inorganic coating
- B32B 2255/26: Polymeric coating
- B32B 2307/546: Flexural strength; Flexion stiffness
- B32B 2307/704: Crystalline
- B32B 2457/00: Electrical equipment
- B32B 2457/20: Displays, e.g. liquid crystal displays, plasma displays
- B41J 2002/14419: {Manifold}
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS

## Abstract

An electronic device is manufactured by a method including applying a photosensitive adhesive agent either to a pressure chamber forming substrate and a vibrating plate or to a sealing plate having a structure of a lower height from a bonding surface, precuring the photosensitive adhesive agent by heating, patterning the precured photosensitive adhesive agent, and bonding the substrates together with the structure (bump electrode) and the photosensitive adhesive agent interposed therebetween.

## Claims

### Claim 1

A manufacturing method of an electronic device that includes a first substrate including a flexurally deformable driving region and a drive element disposed in the driving region so as to deform the driving region, and a second substrate opposed to the first substrate with a spacing from the first substrate and with the drive element and other structure of the first substrate interposed between the first and second substrates, the first and second substrates being bonded together via a thermosetting adhesive agent, the manufacturing method comprising:
applying the adhesive agent to a bonding surface of one of the first substrate and the second substrate that, on an assumption that the adhesive agent is applied to the both substrates so as to cover a structure formed on the respective bonding surfaces, makes a distance of a slope from a top portion of the adhesive agent covering the structure to an edge of a flat region of the adhesive agent shorter; and
bonding the first substrate and the second substrate together, with the structure and the adhesive agent interposed between the first and second substrates.

### Claim 2 (depends on 1)

The manufacturing method according to claim 1, further comprising a patterning process including providing the adhesive agent on respective sides of a region where a structure having a highest height between the first substrate and the second substrate is located.

### Claim 3 (depends on 1)

An electronic device manufactured through the manufacturing method according to claim 1.

### Claim 4 (depends on 2)

An electronic device manufactured through the manufacturing method according to claim 2.