An epoxy resin composition, and prepreg and copper-clad laminate made by using same
OwnerYujun XIN, Yong CHEN +2inventors
InventorsYujun XIN, Yong CHEN, Xianping ZENG, Yongjing XU
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Abstract
The present invention related to an resin compound, especially to an epoxy resin composition and a prepreg and a copper-clad laminate made by using same. The epoxy resin composition of the present invention employs ester compound and flexible amine hardener to cure the epoxy resin, and the resin composition possesses excellent dielectric properties as well as high glass transition temperature and good toughness. The epoxy resin composition of the present invention, which applied in a prepreg and a copper-clad laminate, possesses excellent dielectric properties, high glass transition temperature and good impact toughness.
Claims10
An epoxy resin composition, comprising components as follows:
- epoxy resin, flexible amine hardener and ester compound;
- the flexible amine hardener is poly-1,4-butanediol bis(4-aminobenzoate) or poly(1,4-butanediol-3-methyl-1,4-butanediol)ether bis(4-aminobenzoate) or combination thereof, wherein the chemical structural formula of poly-1, 4-butanediol bis(4-aminobenzoate) is as follows:
- wherein the chemical structural formula of poly(1,4-butanediol-3-methyl-1,4-butanediol)ether bis(4-aminobenzoate) is as follows:
- the active hydrogen equivalent of the flexible amine hardener should be controlled between 100-500 g/eq;
- the amount of the flexible amine hardener, based on the ratio between amine hydrogen equivalent and epoxy resin epoxy equivalent, is 5-30%;
- the amount of the ester compounds, based on the ratio between ester equivalent and epoxy resin epoxy equivalent, is 70-95%.
Dependencies are inferred from the claim text.