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US 2016/0254745 A1Published application
Packaged integrated circuit including a switch-mode regulator and method of forming the same
AssigneeAltera Corporation
InventorsTeik Wah Lim, Ashraf W. Lotfi, Choong Kit Wong, John Weld
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Abstract
A packaged integrated circuit and method of forming the same. The package integrated circuit includes an integrated circuit formed on a semiconductor die affixed to a surface of a multi-layer substrate, and a switch-mode regulator formed on the semiconductor die (or another semiconductor die) affixed to the surface of the multi-layer substrate. The integrated circuit and the switch-mode regulator are integrated within a package to form the packaged integrated circuit.
Claims20
A packaged integrated circuit, comprising:
- a multi-layer substrate;
- an integrated circuit formed on a first semiconductor die affixed to a surface of said multi-layer substrate;
- and
- a switch-mode regulator formed on a second semiconductor die affixed to said surface of said multi-layer substrate.
1 more element
Dependencies are inferred from the claim text.