# US 2016/0252811 A1 · Optical waveguide photosensitive resin composition, photocurable film for forming optical waveguide core layer, optical waveguide using same, and mixed flexible printed circuit board for optical/electrical transmission > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2016/0252811 A1 - Document ID: US20160252811A1 - Status: Published application - Kind: A1 - Application number: 15/030,782 - Filed: 2014-10-24 - Published: 2016-09-01 - Earliest claimed: 2013-11-08 - Assignees: Nitto Denko Corporation - Applicants: Nitto Denko Corporation - Inventors: Tomoyuki Hirayama - Web page: https://patentgrep.com/patent/US20160252811A1 ## CPC - G03F 7/038: Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021) - C08G 59/68: characterised by the catalysts used - C08L 101/00: Compositions of unspecified macromolecular compounds - G02B 6/13: Integrated optical circuits characterised by the manufacturing method - G02B 6/138: by using polymerisation - G02B 6/4281: {the printed circuit boards being flexible (in general H05K1/147)} - G03F 7/0005: {Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor} - G03F 7/0045: {with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors} - G02B 2006/12069: {Organic material} - H05K 1/0274: {Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42)} - H05K 3/287: {Photosensitive compositions} - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract Provided is an optical waveguide photosensitive resin composition containing a photocurable resin and a photopolymerization initiator, in which the photopolymerization initiator is a specific photoacid generator represented by the general formula (1). Accordingly, when a core layer is formed by using the optical waveguide photosensitive resin composition as a material for forming an optical waveguide, especially a core layer-forming material, excellent high transparency (low loss effect) is obtained. In the formula (1), R1 and R2 each represent hydrogen or an alkyl group having 1 to 15 carbon atoms, and may be identical to or different from each other. ## Claims ### Claim 1 An optical waveguide photosensitive resin composition, comprising: a photocurable resin; and a photopolymerization initiator, wherein the photopolymerization initiator comprises a photoacid generator represented by the following general formula (1): in the formula (1), R1 and R2 each represent hydrogen or an alkyl group having 1 to 15 carbon atoms, and may be identical to or different from each other. ### Claim 2 (depends on 1) The optical waveguide photosensitive resin composition according to claim 1, wherein a content of the photopolymerization initiator is from 0.1 part by weight to 3 parts by weight with respect to 100 parts by weight of the photocurable resin. ### Claim 3 (depends on 1) The optical waveguide photosensitive resin composition according to claim 1, wherein the photocurable resin is in a solid state at 25° C. ### Claim 4 (depends on 1) The optical waveguide photosensitive resin composition according to claim 1, wherein the optical waveguide photosensitive resin composition is a core layer-forming material in an optical waveguide including a base material, a cladding layer formed on the base material, and a core layer configured to propagate an optical signal, the core layer being formed in the cladding layer in a predetermined pattern. ### Claim 5 (depends on 1) A photocurable film for forming an optical waveguide core layer, which is obtained by forming the optical waveguide photosensitive resin composition of claim 1 into a film shape. ### Claim 6 (depends on 1) An optical waveguide, comprising: a base material: a cladding layer formed on the base material; and a core layer configured to propagate an optical signal, the core layer being formed in the cladding layer in a predetermined pattern, wherein the core layer is formed by curing the optical waveguide photosensitive resin composition of claim 1. ### Claim 7 (depends on 6) A mixed flexible printed circuit board for optical/electrical transmission, comprising the optical waveguide of claim 6. ### Claim 8 (depends on 5) An optical waveguide, comprising: a base material; a cladding layer formed on the base material; and a core layer configured to propagate an optical signal, the core layer being formed in the cladding layer in a predetermined pattern, wherein the core layer is formed by curing the photocurable film for forming the optical waveguide core layer of claim 5. ### Claim 9 (depends on 8) A mixed flexible printed circuit board for optical/electrical transmission, comprising the optical waveguide of claim 8.