# US 2016/0252572 A1 · Semiconductor integrated circuit device including variable frequency type probe test pad and semiconductor system > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2016/0252572 A1 - Document ID: US20160252572A1 - Status: Published application - Kind: A1 - Application number: 14/724,430 - Filed: 2015-05-28 - Published: 2016-09-01 - Earliest claimed: 2015-02-27 - Assignees: SK hynix Inc. - Applicants: SK hynix Inc. - Inventors: Seung Geun BAEK - Web page: https://patentgrep.com/patent/US20160252572A1 ## CPC - G01R 31/315: by inductive methods - G01R 31/2884: {using dedicated test connectors, test elements or test circuits on the IC under test (G01R31/2855 takes precedence)} - G01R 31/3025: {Wireless interface with the DUT} - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) ## Abstract A semiconductor integrated circuit device including a variable frequency type probe test pad and a semiconductor system are disclosed. The semiconductor integrated circuit device includes a plurality of probe test pads formed on a semiconductor substrate and configured to induce non-contact electrical coupling with a probe card, and a frequency control unit electrically coupled to each of the plurality of probe test pads, and configured to vary a frequency of each of the plurality of probe test pads. ## Claims ### Claim 1 A semiconductor integrated circuit device comprising: a plurality of probe test pads formed on a semiconductor substrate and configured to induce non-contact electrical coupling with a probe card; and a frequency control unit electrically coupled to each of the plurality of probe test pads, and configured to vary a frequency of each of the plurality of probe test pads. ### Claim 2 (depends on 1) The semiconductor integrated circuit device of claim 1, wherein the plurality of probe test pads are formed in an inductance generation structure to perform an antenna operation. ### Claim 3 (depends on 1) The semiconductor integrated circuit device of claim 1, wherein the plurality of probe test pads are provided in a same shape. ### Claim 4 (depends on 1) The semiconductor integrated circuit device of claim 1, wherein the plurality of probe test pads are provided in different shapes from each other. ### Claim 5 (depends on 1) The semiconductor integrated circuit device of claim 1, wherein the frequency control unit includes a plurality of capacitors electrically coupled to each of the plurality of probe test pads and electrically coupled substantially in parallel to each other, and a plurality of switches configured to selectively electrically couple the plurality of capacitors electrically coupled in parallel. ### Claim 6 (depends on 5) The semiconductor integrated circuit device of claim 5, further comprising a device layer between the semiconductor substrate and the probe test pads, wherein the frequency control unit includes a plurality of conductive layers formed in the device layer, and insulating layers interposed between the conductive layers. ### Claim 7 (depends on 1) The semiconductor integrated circuit device of claim 1, wherein the frequency control unit is a voltage controlled oscillator (VCO). ### Claim 8 A semiconductor system comprising: a semiconductor device including a plurality of probe test pads disposed to face a probe electrode of a probe card, and configured to have an antenna structure and induce non-contact electrical coupling with the probe electrode and a frequency control unit electrically coupled to the plurality of probe test pads and configured to vary frequencies of the plurality of probe test pads; and a controller configured to perform interfacing with the semiconductor device and transfer a test command to the plurality of probe test pads. ### Claim 9 (depends on 8) The semiconductor system of claim 8, wherein the plurality of probe test pads are provided in a same shape. ### Claim 10 (depends on 8) The semiconductor system of claim 8, wherein the plurality of probe test pads are provided in different shapes from each other. ### Claim 11 (depends on 8) The semiconductor system of claim 8, wherein the frequency control unit includes a plurality of capacitors electrically coupled to the plurality of probe test pads and electrically coupled substantially in parallel to each other, and a plurality of switches configured to selectively electrically couple the plurality of capacitors electrically coupled in parallel. ### Claim 12 (depends on 11) The semiconductor system of claim 11, further comprising a device layer between the semiconductor substrate and the probe test pads, wherein the frequency control unit includes a plurality of conductive layers formed in the device layer, and insulating layers interposed between the conductive layers. ### Claim 13 (depends on 8) The semiconductor system of claim 8, wherein the frequency control unit is a voltage controlled oscillator (VCO). ### Claim 14 A semiconductor probe testing method comprising: providing a plurality of probe test pads adjacent to each other; performing a non-contact probe test on a first probe test pad among the plurality of probe test pads in a first frequency; and performing an other non-contact probe test on a second probe test pad adjacent to the first probe test pad in a second frequency different from the first frequency. ### Claim 15 (depends on 14) The semiconductor probe testing method of claim 14, further comprising: electrically coupling a voltage controlled oscillator to one of the plurality of probe test pads. ### Claim 16 (depends on 15) The semiconductor probe testing method of claim 15, wherein the one of the plurality of probe test pads is configured in an antenna structure. ### Claim 17 (depends on 14) The semiconductor probe testing method of claim 14, wherein the plurality of probe test pads each provide different frequencies from each other. ### Claim 18 (depends on 14) The semiconductor probe testing method of claim 14, wherein the plurality of probe test pads each provide a same inductance.