Led die dispersal in displays and light panels with preserving neighboring relationship

Apparatus designed to disperse semiconductor chips from a wafer of semiconductor chips onto a substrate while preserving the neighboring relationship of each chip to each adjacent chip, the apparatus comprising:

• a movably mounted first carrier with a layer of releasable adhesive deposited thereon and having a wafer cut into individual chips in m columns and n rows releasably adhered thereon;
• a movably mounted intermediate carrier with a layer of releasable adhesive deposited thereon;
• a first element mounted for movement in synchronism with the movably mounted first carrier and the movably mounted intermediate carrier;
• first release apparatus positioned to release each sequential column from the first carrier;
• the first element being designed and positioned so that movement of the first element provides pressure between released sequential columns of the wafer and the first carrier to disperse the sequential columns of semiconductor chips to the intermediate carrier with a first pitch between columns while preserving the neighboring relationship, each released column being adhered to the intermediate carrier with the layer of releasable adhesive as each column is dispersed from the first carrier to the intermediate carrier;
• a second element mounted for movement in synchronism with the movably mounted intermediate carrier and a movably mounted substrate;
• second release apparatus positioned to release each sequential row from the intermediate carrier;
• and
• the second element being designed and positioned so that movement of the second element provides pressure between the intermediate carrier and released sequential rows of the wafer to disperse the sequential rows of semiconductor chips to a substrate with a second pitch between rows while preserving the neighboring relationship.

A method of making electronic devices of large in x/z and y/z dimension ratio including the steps of:

• Providing LED die chips each including at least two contact electrodes, one of the at least two contact electrodes being positioned on a lower surface of the LED die chip and one of the at least two contact electrodes being positioned on an upper surface of the LED die chip;
• dispersing the LED die chips from a wafer carrier into an array on a carrier substrate, with the array having a pre-defined dimension dilution factor and preserved neighboring relationship;
• forming an insulation planarization layer on the array among the dispersed LED die chips;
• and
• forming a passivation/optic layer on the array on top of the dispersed LED die chips.

An electronic device including an array of elements and of large in x/z and y/z dimension ratio comprising:

• a carrier substrate;
• at least one LED die chip in each array element, each LED die chip comprising at least two contact electrodes, wherein neighbor die chips keep an original neighborhood relationship from their original wafer, and are separated from each other with a pre-defined dimension dilution factor;
• an insulation planarization layer on the carrier substrate and among the separated die chips;
• and
• a passivation/optic layer on the array on top of the separated die chips.