Thermosetting resin sandwich prepreg, preparation method thereof and copper clad laminate therefrom
AssigneeShengyi Technology Co., Ltd.
InventorSonggang CHAI
Life of this patent
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Abstract
The present invention relates to a thermosetting resin sandwich prepreg, and the copper clad laminates and multi-layered printed circuit wiring boards manufactured therefrom. The interlayer of the thermosetting resin sandwich prepreg contains the thermosetting resin composition with a high content of fillers, and the outer layer of the prepreg contains the thermosetting resin composition with a low content of fillers. The copper clad laminates prepared by using the prepregs have good adhesion to metal foils, insulativity and uniform dielectric constant distribution.
Claims14
A thermosetting resin sandwich prepreg, comprising an interlayer and outer layers cladded on the both sides of the interlayer;
- the interlayer includes 20-80% by weight of a fillers, 20-70% by weight of a reinforcing material, 0-30% by weight of a thermosetting resin, based on the filler, the reinforcing material, and the thermosetting resin totaling 100% by weight;
- the outer layer includes 0-20% by weight of a fillers and 20-80% by weight of a thermosetting resin, based on the fillers and the thermosetting resin totaling 100% by weight.
Dependencies are inferred from the claim text.