Bonded assembly provided with a intermediate deformation layer with variable flexibility
AssigneeCold Pad
InventorJean-Philippe COURT
Life of this patent
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Abstract
A bonded assembly designed for assembling a substrate to a structure or indeed to reinforce a structure. The bonded assembly includes: first and second substrates, an intermediate layer rigidly connected to the first substrate, and having flexibility that varies along the first substrate, the variable flexibility resulting from a variation in the thickness of at least one material of the intermediate layer, an adhesive between the intermediate layer and the second substrate.
Claims17
1-15. (canceled)
A bonded assembly comprising at least:
- a first substrate,
- a second substrate,
- an intermediate layer rigidly connected to the first substrate and having a variable flexibility along the first substrate, with the variable flexibility resulting from a variation in the thickness of at least one material of the intermediate layer,
- an adhesive between said intermediate layer and the second substrate.
A method for manufacturing an element of a bonded assembly, with the method comprising:
- forming a first layer presenting a chamfered profile,
- pouring a material in liquid form into a mould comprising the first layer of the chamfered profile;
- forming a second layer via solidification of the material poured, with the second layer once solidified being more flexible than the first layer,
- the first layer and the second layer together forming an intermediate layer to be placed between two substrates in the bonded assembly.
A method for reinforcing a structure comprising at least one substrate to be reinforced, with the method comprising:
- rigidly connecting with a reinforcing substrate an intermediate layer having a variable flexibility along the reinforcing substrate, with the variable flexibility resulting from a variation in the thickness of at least one material of the intermediate layer, and
- maintaining the reinforcing substrate and the intermediate layer on the substrate to be reinforced by the intermediary of an adhesive.
Dependencies are inferred from the claim text.