US 2016/0243673 A1 · METHOD AND DEVICE FOR CUTTING OUT HARD-BRITTLE SUBSTRATE

Abstract

To cut out a bard-brittle substrate by blasting, laying out substrates 2 on a plate material 1 made of a hard-brittle material with leaving a space for blasting; forming first protective films 4 on both surfaces of the plate material 1 at layout positions of the substrates 2 and forming second protective films 5 on both surfaces of a margin 3 of the plate material 1 with leaving a space with respect to the first protective films 4 and having outer edges from a periphery of the plate material 1 at a width of 5 mm or less; cutting regions 6 between the films 4, 4 and between the films 4, 5 from one surface of the plate material 1 to a depth of approximately half of a thickness thereof by blasting, then cutting from the other surface of the plate material 1 until the plate material 1 is penetrated.

Claims3

Dependent claims

1-5. (canceled)

A device for cutting out a hard-brittle substrate wherein a plurality of substrates to be cut out from a plate material made of a hard-brittle material is laid out on the plate material with leaving a space which is required for cutting by blasting;

first protective films with blast-resistant property are formed on each of front and back surfaces of the plate material at a position where each of the substrates is laid out;
second protective films with blast-resistant property are formed on outer edges of the substrates with leaving a space which is required for cutting by blasting;
a margin of the plate material is covered so that an exposed width in a peripheral portion of the plate material is equal to or less than 5 mm thereby the plate material is a subject to be processed;
the device comprising:
a plate material suspension jig including a suction fixing plate for fixing by suction the front surface of the plate material and holding the plate material fixed by suction to the suction fixing plate in a state that the plate material is floated in midair;
an ejection nozzle for back surface processing configured to eject abrasives to the back surface of the plate material suspended by the plate material suspension jig;
a plate material mounting jig for mounting the plate material after blasting from the back surface of the plate material, the plate material mounting jig including:
a plurality of suction fixing bases for substrates with plane shapes corresponding to the substrates to be cut out, configured to fix by suction and mount thereon portions which are covered with the first protective films in the back surface of the plate material;
and a margin base disposed at an outer periphery position of a group of the plurality of suction fixing bases for substrates, configured to mount thereon the portions which are covered with the second protective film in the plate material;
and
an ejection nozzle for front surface processing configured to eject abrasives to the front surface of the plate material mounted on the plate material mounting jig.

8 more elements

Dependencies are inferred from the claim text.

Facts

Application

15/090,875Filed 5 Apr 2016

Priority

JP 2012-1070528 May 2012

Published

25 Aug 2016

Term ends

Not estimatedThe source records don’t support an estimate.

Classification5 codes

B24C 3/18
Abrasive blasting machines or devices; Plants: essentially provided with means for moving workpieces into different working positions
B24C 1/04
Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods: for treating…
B24C 1/045
For treating only selected parts of a surface, e.g. for carving stone or glass: for cutting
B24C 3/32
Abrasive blasting machines or devices; Plants: designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks

Method and device for cutting out hard-brittle substrate

Life of this patent

Method and device for cutting out hard-brittle substrate

Life of this patent

Abstract

Claims3