Retainer ring, substrate holding apparatus, and polishing apparatus, and retainer ring maintenance method
AssigneeEbara Corporation
InventorsMakoto FUKUSHIMA, Hozumi YASUDA, Keisuke NAMIKI
Life of this patent
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Abstract
According to one embodiment, a retainer ring for retaining a substrate to be polished, includes: an inside ring arranged to enclose the substrate; and an outside ring arranged outside the inside ring, abrasion-resistant of the outside ring being higher than abrasion-resistant of the inside ring, wherein the inside ring having a thickness in a radial direction in a range from a minimum of 0.05 mm to a maximum of 5 mm.
Claims29
A retainer ring for retaining a substrate to be polished, the retainer ring comprising:
- an inside ring arranged to enclose the substrate;
- and
- an outside ring arranged outside the inside ring, abrasion-resistant of the outside ring being higher than abrasion-resistant of the inside ring,
- wherein the inside ring having a thickness in a radial direction in a range from a minimum of 0.05 mm to a maximum of 5 mm.
A method for maintaining a retainer ring for retaining a substrate to be polished, the retainer ring comprising:
- an inside ring arranged to enclose the substrate;
- and
- an outside ring arranged outside the inside ring, abrasion-resistant of the outside ring being higher than abrasion-resistant of the inside ring,
- wherein the inside ring having a thickness in a radial direction in a range from a minimum of 0.05 mm to a maximum of 5 mm, and
- wherein the inside ring is detachably attached to the outside ring,
- the method comprising:
- removing the inside ring from the outside ring;
- and
- fixing a new inside ring onto the outside ring.
A retainer ring for retaining a substrate to be polished, the retainer ring comprising:
- an inside ring arranged to enclose the substrate;
- and
- an outside ring arranged outside the inside ring, the outside ring comprising a lower ring and an upper ring,
- wherein abrasion-resistant of the lower ring is higher than abrasion-resistant of the inside ring, and
- toughness of the upper ring is higher than toughness of the lower ring.
The retainer ring according to claim 19, wherein surface roughness of a lower surface of the outside ring is a maximum of Ra 1.6 μm.
A retainer ring for retaining a substrate to be polished, the retainer ring comprising:
- an inside ring arranged to enclose the substrate;
- an outside ring arranged outside the inside ring, abrasion-resistant of the outside ring being higher than abrasion-resistant of the inside ring and the outside ring being harder than the inside ring;
- wherein the outside ring and the inside ring are individually, vertically movable each other, and
- the outside ring is either contact-less with the polishing pad, or is pressed onto the polishing pad with a force smaller than another force pressing the inside ring onto the polishing pad.
Dependencies are inferred from the claim text.