Electronic device

An electronic device comprising:

• a substrate made of a semiconductor material and having a substrate obverse surface and a substrate reverse surface that are opposite to each other in a thickness direction of the substrate;
• an electronic element mounted on the substrate;
• a conductive layer electrically connected to the electronic element;
• a sealing resin;
• and
• a columnar conductor, wherein
• the substrate is formed with an element-receiving recess recessed from the substrate obverse surface and having a recess bottom surface,
• the electronic element is mounted on the recess bottom surface,
• the conductive layer has an obverse-surface contacting region located on the substrate obverse surface,
• the sealing resin is disposed in at least a part of the element-receiving recess and covers at least a part of the substrate obverse surface, and
• the columnar conductor is electrically connected to the obverse-surface contacting region of the conductive layer and exposed from the sealing resin at a side opposite to the substrate obverse surface.