Wiring board and method of manufacturing same
AssigneeMurata Manufacturing Co., Ltd.
InventorRyota ASAI
Life of this patent
Estimating the term…
Abstract
A wiring board is provided with: an insulating layer; a base electrode layer layered on one primary surface of the insulating layer in predetermined regions; an insulating covering layer layered on one primary surface of the insulating layer in a state covering parts of edges of the base electrode layer; and a surface electrode layer plated on exposed portions of the base electrode layer not covered by the insulating covering layer, the thickness of covered portions of the base electrode layer covered by the insulating covering layer being less than the thickness of the exposed portions. The surface electrode layer is formed only on the exposed portions of the base electrode layer.
Claims11
A wiring board comprising:
- an insulating layer;
- a base electrode layer layered upon a predetermined region of one primary surface of the insulating layer;
- an insulating covering layer layered upon the one primary surface of the insulating layer in a state covering at least part of an edge portion of the base electrode layer;
- and
- a surface electrode layer plated on an exposed portion of the base electrode layer that is not covered by the insulating covering layer,
- wherein the covered portion of the base electrode layer covered by the insulating covering layer is formed so as to be thinner than the exposed portion.
A method of manufacturing a wiring board including an insulating layer, the method comprising:
- a base electrode layer forming step of layering a base electrode layer on a predetermined region of one primary surface of the insulating layer by screen printing using a conductive paste and a mask member;
- an insulating covering layer forming step of layering an insulating covering layer upon the one primary surface of the insulating layer in a state covering at least part of an edge portion of the base electrode layer;
- and
- a surface electrode layer forming step of plating a surface electrode layer on an exposed portion of the base electrode layer that is not covered by the insulating covering layer,
- wherein in the base electrode layer forming step, the covered portion of the base electrode layer is formed so as to be thinner than the exposed portion by forming a predetermined hole pattern that suppresses the conductive paste from escaping in a location of the mask member that corresponds to the covered portion of the base electrode layer covered by the insulating covering layer.
A method of manufacturing a wiring board including an insulating layer, the method comprising:
- a base electrode layer forming step of layering a base electrode layer on a predetermined region of one primary surface of the insulating layer by screen printing using a conductive paste and a mask member;
- an insulating covering layer forming step of layering an insulating covering layer upon the one primary surface of the insulating layer in a state covering at least part of an edge portion of the base electrode layer;
- and
- a surface electrode layer forming step of plating a surface electrode layer on an exposed portion of the base electrode layer that is not covered by the insulating covering layer,
- wherein in the base electrode layer forming step, the conductive paste is applied to the covered portion of the base electrode layer covered by the insulating covering layer and the exposed portion at a uniform thickness, and the conductive paste is then further applied only to the exposed portion.
Dependencies are inferred from the claim text.