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US 2016/0242284 A9Published application
Printed circuit board having metal bumps
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsMyung Sam KANG, Jeong Woo PARK, Ok Tae KIM, Kil Yong YUN
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Abstract
A printed circuit board includes an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal; and a metal bump formed on the circuit pattern and the insulating layer
Claims7
A printed circuit board comprising:
- an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal;
- and
- a metal bump formed on the circuit pattern and the insulating layer.
Dependencies are inferred from the claim text.