Reflected signal absorption in interconnect
AssigneeIntel Corporation
InventorsShaowu Huang, John J. Abbott
Life of this patent
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AssigneeIntel Corporation
InventorsShaowu Huang, John J. Abbott
Estimating the term…
Embodiments of the present disclosure are directed toward techniques and configurations for electrical signal absorption in an interconnect stub. In one instance, a printed circuit board (PCB) assembly may comprise a substrate and an interconnect (such as a via) formed in the substrate to route an electrical signal within the PCB. The interconnect may include a stub formed on the interconnect. At least a portion of the stub may be covered with an absorbing material to at least partially absorb a portion of the electric signal that is reflected by the stub. The absorbing material may be selected such that its dielectric loss tangent is greater than one, for a frequency range of a frequency of the reflected portion of the electric signal. A dielectric constant of the absorbing material may be inversely proportionate to the frequency of the reflected electric signal. Other embodiments may be described and/or claimed.
A printed circuit board (PCB) assembly comprising:
A method, comprising:
Dependencies are inferred from the claim text.