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US 2016/0242272 A1Published application
Electronic circuit and heat sink
AssigneesKitagawa Industries Co., Ltd., Tyk Corporation
InventorsYasuhiro KAWAGUCHI, Masataka KUBO
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Abstract
An electronic circuit of the present invention includes: a circuit board on which an electronic component is mounted; a heat conducting sheet stacked on the electronic component; and a heat sink stacked on the heat conducting sheet. The heat sink includes a porous ceramics having a volume resistivity of 1010 Ohm·cm or more and a porosity of 15-50 vol %.
Claims8
1-5. (canceled)
A method of manufacturing an electronic circuit comprising:
- a circuit board on which an electronic component is mounted;
- a heat conducting sheet stacked on the electronic component;
- and
- a heat sink stacked on the heat conducting sheet,
- wherein the heat sink comprises a porous ceramics having a volume resistivity of 1010 Ohm·cm or more and a porosity of 15-50 vol %, the method comprising:
- mixing at least silica dioxide, alumina and silicon carbide to produce granulated particles having a particle diameter of 10 μm or more;
- and
- sintering the produced granulated particles at a temperature of 1,000-1,400° C., thereby eliminating the generation of high frequency noise.
5 more elements
A method of manufacturing a heat sink comprising:
- a porous ceramics having a volume resistivity of 1010 Ohm·cm or more and a porosity of 15-50 vol %, the method comprising:
- mixing at least silica dioxide, alumina and silicon carbide to produce granulated particles having a particle diameter of 10 μm or more;
- and
- sintering the produced granulated particles at a temperature of 1,000-1,400° C.
1 more element
Dependencies are inferred from the claim text.