Low profile zero/low insertion force package top side flex cable connector architecture
AssigneeIntel Corporation
InventorsSanka Ganesan, Ram S. Viswanath
Life of this patent
Estimating the term…
Abstract
An integrated circuit package is presented. In an embodiment, the integrated circuit package has contact pads formed on the top side of a package substrate, a die electrically attached to the contact pads, and input/output (I/O) pads formed on the top side of the package substrate. The I/O pads are electrically connected to the contact pads. The integrated circuit package also includes a flex cable receptacle electrically connected to the I/O pads on the top side of the package substrate. The flex cable receptacle is non-compressively attachable to a flex cable connector and includes receptacle connection pins electrically connected to the I/O pads.
Claims6
A flex cable assembly, comprising:
- a flex cable comprising:
- a connector portion formed on at least one of two ends of the flex cable, wherein the connector portion includes a plurality of cable contacts;
- and
- a transmission portion formed between the two ends of the flex cable, wherein the transmission portion comprises a plurality of traces electrically coupled to the plurality of cable contacts.
- a flex cable stiffener disposed on a top side of the connector portion of the flex cable;
- and
- a flex cable connector attached to a bottom side of the connector portion of the flex cable, wherein the flex cable connector includes a plurality of connector connection pins electrically coupled to the plurality of cable contacts, and the flex cable connector is attachable to a flex cable receptacle that is mounted on a package substrate of an integrated circuit package.
Dependencies are inferred from the claim text.