Piezoelectric thin film stack
AssigneesHewlett-Packard Development Company, L.P., The State of Oregon acting by and through the State Board of Higher Education on behalf of Orego
InventorsJames Elmer ABBOTT, JR., Peter MARDILOVICH, Brady GIBBONS, Bryan Alexander MAACK
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Abstract
The present disclosure is drawn to a piezoelectric thin film stack and method of preparing the same. The piezoelectric thin film stack can comprise a substrate with an oxide application surface, a metal oxide adhesive blend layer applied to the oxide application surface, and a piezoelectric film applied directly to the metal oxide adhesive blend layer.
Claims20
A piezoelectric thin film stack, comprising a substrate with an oxide application surface, a metal oxide adhesive blend layer applied to the oxide application surface, and a piezoelectric film applied directly on and adhered to the metal oxide adhesive blend layer.
A method of preparing a piezoelectric thin film stack, comprising:
- depositing a metal oxide adhesive blend layer to an oxide application surface of a substrate;
- depositing a piezoelectric film directly on and adhered to the metal oxide adhesive blend layer.
Dependencies are inferred from the claim text.