Flip-chip light emitting diode and method for manufacturing the same
OwnerHsiu Chang HUANGinventor
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Abstract
This invention relates to a flip-chip light-emitting diode and a method for manufacturing the same. The flip-chip light-emitting diode comprises a packaging body and a conductor layer. At least one light-emitting diode chip is encapsulated in the packaging body. The light emitting diode chip has a positive electrode and a negative electrode which are exposed on a side surface of the packaging body. The conductor layer is disposed on the side surface of the packaging body and directly in contact with the positive electrode and the negative electrode of the light-emitting diode chip. The conductor layer has circuit patterns and an insulating portion insulating the positive electrode and the negative electrode of the light-emitting diode chip from each other.
Claims35
A method for manufacturing a flip-chip light-emitting diode, the method comprising steps of:
- providing a packaging body including at least one light-emitting diode chip which has a positive electrode and a negative electrode that are exposed on a side surface of the packaging body;
- and
- forming a conductor on the side surface of the packaging body, wherein the positive electrode and the negative electrode of the light-emitting diode chip are insulated from each other.
A flip-chip light-emitting diode comprising:
- a packaging body in which at least one light-emitting diode chip is encapsulated, the light-emitting diode chip having a positive electrode and a negative electrode, the positive electrode and the negative electrode being exposed on a side surface of the packaging body;
- and
- a conductor layer disposed on the side surface of the packaging body and directly in contact with the positive electrode and the negative electrode of the light-emitting diode chip, the conductor layer having circuit patterns and an insulating portion which insulates the positive electrode and the negative electrode of the light-emitting diode chip from each other.
Dependencies are inferred from the claim text.