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US 2016/0240759 A1Published application
Light emitting device
AssigneeSeoul Viosys Co., Ltd.
InventorsJong Hyeon CHAE, So Ra LEE, Kyung Hee YE
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Abstract
A light emitting device in which a bonding pad is soldered to a mounting substrate, wherein the bonding pad may be formed in various shapes that can minimize the occurrence of voids during soldering or heat fusion.
Claims23
A light emitting device, comprising:
- a first bonding pad configured to be soldered to a mounting substrate;
- a first electrode electrically connected to the first bonding pad via a first connection electrode;
- a first conductive type semiconductor layer connected to the first electrode;
- and
- a solder ball contactable region and a non-conductive region,
- wherein:
- the first bonding pad comprises at least two elongate, opposed regions disposed in the solder ball contactable region;
- and
- the non-conductive region is disposed between the at least two elongate, opposed regions.
6 more elements
A light emitting device, comprising:
- a first bonding pad configured to be soldered to a mounting substrate;
- a first electrode electrically connected to the first bonding pad via a first connection electrode;
- and
- a first conductive type semiconductor layer connected to the first electrode,
- wherein:
- the first bonding pad is disposed in a portion of a solder ball contactable region;
- and
- a non-conductive pattern is disposed in the remaining portion of the solder ball contactable region, through which by-products generated during soldering escape.
5 more elements
Dependencies are inferred from the claim text.