Optoelectronic component and method of producing same

An optoelectronic component comprising a housing comprising:

• a plastic material and a first lead frame section at least partially embedded in the plastic material,
• a first recess and a second recess,
• wherein a first upper section of an upper side of the first lead frame section is not covered by the plastic material in the first recess,
• a second upper section of the upper side of the first lead frame section is not covered by the plastic material in the second recess,
• the first recess and the second recess are separated from one another by a section of the plastic material,
• an optoelectronic semiconductor chip is arranged in the first recess, and
• no optoelectronic semiconductor chip is arranged in the second recess.

An optoelectronic component comprising a housing comprising a plastic material and a first lead frame section at least partially embedded in the plastic material, and

• a first recess and a second recess,
• wherein a first upper section of an upper side of the first lead frame section is not covered by the plastic material in the first recess,
• a second upper section of the upper side of the first lead frame section is not covered by the plastic material in the second recess,
• the first recess and the second recess are separated from one another by a section of the plastic material,
• an optoelectronic semiconductor chip is arranged in the first recess,
• no optoelectronic semiconductor chip is arranged in the second recess, and
• the second upper section of the first lead frame section has a marking.

A method of producing an optoelectronic component comprising:

• arranging a lead frame in a molding tool, a first part of the molding tool bearing on a first upper section of an upper side of the lead frame;
• a second part, separated from the first part, of the molding tool bearing on a second upper section of the upper side of the lead frame;
• embedding the lead frame in a plastic material;
• and
• arranging an optoelectronic semiconductor chip only on the first upper section of the upper side of the lead frame, but not on the second upper section.