Film-Like Thermosetting Silicone Sealing Material
OwnerShin Yoshida, Masaaki Amakoinventors
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Abstract
The present invention relates to a film-like thermosetting silicone sealing material for sealing a semiconductor element by means of compression molding, the sealing material having an initial torque value of less than 15 dN·m as measured by an MDR (Moving Die Rheometer) at a molding temperature of from room temperature to 200° C., to a method for producing an LED by means of compression molding using the same, and to an LED produced by this method. The sealing material has excellent moldability, causes no problems such as overflow from a die, and has no defects such as voids.
Claims13
A film-like thermosetting silicone sealing material for sealing a semiconductor element by compression molding, wherein the sealing material has an initial torque value of less than 15 dN·m as measured by a Moving Die Rheometer (MDR) at a molding temperature of from room temperature to 200° C. and is produced by curing a silicone composition to a B-stage defined by JIS K 6800, wherein the silicone composition comprises:
- (A) 100 parts by mass of an alkenyl group-containing organopolysiloxane raw rubber;
- (B) from 30 to 150 parts by mass of wet method hydrophobized reinforcing silica having a BET method specific surface area of at least 200 m2/g, wherein the silica comprises organopolysiloxane units selected from the group consisting of R3SiO1/2 units, R2SiO2/2 units, RSiO3/2 units, where each R is independently a monovalent hydrocarbon group, and mixtures thereof and SiO4/2 units, wherein the molar ratio of the organopolysiloxane units to the SiO4/2 units is from 0.08 to 2.0;
- (C) from 0.1 to 10 parts by mass of an organohydrogenpolysiloxane;
- and
- (D) a sufficient amount of a curing agent to cure the composition.
(canceled)
An LED comprising an LED chip, a cured product of a film-like thermosetting silicone sealing material covering the chip, and a film covering a surface of the cured product.
Dependencies are inferred from the claim text.