Systems and methods for assembling two-dimensional materials
AssigneeThe Trustees of Columbia University in the City of New York
InventorsKenneth L. Shepard, Inanc Meric, Cory R. Dean, Lei Wang, James Hone
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Abstract
Heterostructures can include multilevel stacks with an electrical contact on a one-dimensional edge of a two-dimensional active layer. A multilevel stack can be provided having a first two-dimensional layer encapsulated between a second layer and a third layer. A first edge of the first two-dimensional layer can be exposed by etching. A metal can be deposited on the edge of the first two-dimensional layer to form an electrical contact.
Claims45
A method for connecting an electrical contact to a two-dimensional layer along a one-dimensional edge thereof comprising:
- providing a multilevel stack comprising a first two-dimensional layer encapsulated between a second layer and a third layer;
- exposing an edge of the first two-dimensional layer;
- and
- depositing a metal on the edge of the first two-dimensional layer.
A heterostructure manufactured by a process comprising:
- providing a multilevel stack comprising a first two-dimensional layer encapsulated between a second layer and a third layer;
- exposing an edge of the first two-dimensional layer;
- and
- depositing a metal on the edge of the first two-dimensional layer.
A heterostructure comprising:
- a first two-dimensional layer comprising an electrical contact disposed on a one-dimensional edge thereof;
- a second layer;
- and
- a third layer,
- wherein the first two-dimensional layer is disposed between the second layer and the third layer.
Dependencies are inferred from the claim text.