Power semiconductor device
AssigneeMitsubishi Electric Corporation
InventorKatsumi NAKAMURA
Life of this patent
Estimating the term…
Abstract
A semiconductor substrate has a first surface and a second surface. A gate electrode has a part buried in a first trench. A capacitor electrode has a part buried in a second trench. An interlayer insulating film is provided on the second surface and having a first contact hole and a second contact hole. A first main electrode is provided on the first surface. A second main electrode contacts the second surface through the first contact hole and contacts the capacitor electrode through the second contact hole. The first and second trenches cross a first range of the second surface. The first and second contact holes are located only in the first range and a second range respectively of the second surface.
Claims5
A power semiconductor device comprising:
- a semiconductor substrate having a first surface and a second surface opposite said first surface, said semiconductor substrate including a first region having a first conductivity type, a second region provided on said first region and having a second conductivity type different from said first conductivity type, and a third region provided on said second region and arranged in said second surface and having said first conductivity type, said second surface being provided with a plurality of first trenches and a plurality of second trenches, said first trenches facing said first to third regions;
- a first main electrode provided on said first surface of said semiconductor substrate;
- a trench insulating film covering said first trenches and said second trenches of said semiconductor substrate;
- a gate electrode having parts buried in said first trenches with said trench insulating film therebetween;
- a capacitor electrode having parts buried in said second trenches with said trench insulating film therebetween;
- an interlayer insulating film provided on said second surface and having a first contact hole and a second contact hole;
- and
- a second main electrode provided on said interlayer insulating film, contacting said third region through said first contact hole, and contacting said capacitor electrode through said second contact hole, wherein
- said second surface of said semiconductor substrate has a first range in one direction on said second surface and a second range out of said first range toward said one direction,
- each of said first trenches and each of said second trenches cross said first range in said one direction,
- regarding said first and second ranges, said first contact hole is located only in said first range and said second contact hole is located only in said second range,
- said second surface of said semiconductor substrate has a third range out of said second range toward said one direction,
- said first trenches extend from said first range into said third range through said second range, and
- said second trenches each have an end portion located in said second range.
(canceled)
Dependencies are inferred from the claim text.