Stacked embedded spad image sensor for attached 3d information

An image sensing system, comprising:

• a light source to emit infrared (IR) light pulses to an object;
• a pixel array to receive visible light and reflected IR light pulses from the object, wherein the pixel array includes:
• a plurality of visible light pixels arranged in the pixel array, wherein each one of the plurality of visible light pixels includes a photosensitive element arranged in a first semiconductor die to detect the visible light from the object, wherein each one of the plurality of visible light pixels is coupled to provide color image data to visible light readout circuitry disposed in a second semiconductor die stacked with and coupled to the first semiconductor die in a stacked chip scheme;
• and
• a plurality of IR pixels arranged in the pixel array, wherein each one of the plurality of IR pixels includes a single photon avalanche photodiode (SPAD) arranged in the first semiconductor die to detect the reflected IR light pulses from the object to generate time of flight information, wherein each one of the plurality of visible light pixels is coupled to provide IR image data to IR light readout circuitry disposed in the second semiconductor die;
• and
• control circuitry coupled to control operation of the pixel array and control and synchronize the light source with a sync signal to synchronize a timing of the emission of the light pulses with the sensing of the photons reflected from the object.