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US 2016/0240509 A1Published application
Semiconductor packages
AssigneeSamsung Electronics Co., Ltd.
InventorsHeungkyu KWON, Kang Joon LEE, JaeWook YOO, Su-Chang LEE
Life of this patent
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Abstract
Semiconductor packages include a first substrate including a central portion and a peripheral portion, at least one first central connection member attached to the central portion of the first substrate, and at least one first peripheral connection member attached to the peripheral portion of the first substrate. The first central connection member includes a first supporter and a first fusion conductive layer surrounding the first supporter.
Claims21
1-20. (canceled)
A semiconductor package comprising:
- a first substrate;
- a first semiconductor chip mounted on the first substrate;
- a second substrate disposed on the first substrate, the second substrate including a central portion and a peripheral portion around the central portion;
- a plurality of first connection members attached to the peripheral portion of the second substrate and interposed between the first and second substrates;
- and
- a plurality of second connection members attached to the peripheral portion of the second substrate and interposed between the first and second substrates,
- wherein the first semiconductor chip is under the central portion of the second substrate,
- wherein the first connection members are adjacent to a side of the central portion,
- wherein the second connection members are adjacent to a vertex of the central portion, and
- wherein each of the first connection members includes a first supporter and a first fusion conductive layer surrounding the first supporter.
7 more elements
A semiconductor package comprising:
- a first substrate;
- a first semiconductor chip mounted on the first substrate;
- a second substrate disposed on the first substrate, the second substrate including a central portion having a cross shape and peripheral portions around the central portion;
- a plurality of first connection members attached to a first region of the central portion of the second substrate and interposed between the first and second substrates;
- and
- a plurality of second connection members attached to at least one of the peripheral portions of the second substrate and interposed between the first and second substrates,
- wherein the first semiconductor chip is under a second region of the central portion of the second substrate, and
- wherein each of the first connection members includes a first supporter and a first fusion conductive layer surrounding the first supporter.
5 more elements
A semiconductor package comprising:
- a first sub semiconductor package including a first substrate and a first semiconductor chip mounted on a top surface of the first substrate;
- a second sub semiconductor package on the first sub semiconductor package, the second sub semiconductor package including a second substrate and a second semiconductor chip mounted on a top surface of the second substrate;
- a plurality of central connection members attached to a central portion of the first semiconductor chip and interposed between the first substrate and the first semiconductor chip;
- a plurality of peripheral connection members attached to a peripheral portion of the first semiconductor chip and interposed between the first substrate and the first semiconductor chip;
- and
- a plurality of first connection members attached to a peripheral portion of the second substrate and interposed between the first and second substrates,
- wherein the first semiconductor chip is under a central portion of the second substrate,
- wherein each of the central connection members includes a first supporter and a first fusion conductive layer surrounding the first supporter,
- wherein each of the first connection members includes a second supporter and a second fusion conductive layer surrounding the second supporter, and
- wherein a height of the first connection member is higher than a height of the central connection member.
7 more elements
Dependencies are inferred from the claim text.