Package Structures and Methods of Forming the Same

A structure comprising:

• a package component comprising a redistribution structure on an encapsulated first die;
• first conductive pillars on the redistribution structure at least laterally encapsulated by a first encapsulant;
• a second die on the redistribution structure at least laterally encapsulated by the first encapsulant, the first encapsulant having a first surface distal from the redistribution structure;
• and
• second conductive pillars protruding from the first surface of the first encapsulant, each of the second conductive pillars being electrically coupled to a respective one of the first conductive pillars.

A method comprising:

• encapsulating a first die with a first encapsulant;
• forming a redistribution structure on the first die and the first encapsulant;
• forming a first conductive pillar on the redistribution structure and in a central region of the redistribution structure;
• forming a second conductive pillar on the redistribution structure and in a periphery region of the redistribution structure, a width of the first conductive pillar being less than a width of the second conductive pillar;
• attaching a second die to the redistribution structure using the first conductive pillar;
• at least laterally encapsulating the second die and the second conductive pillar with a second encapsulant;
• and
• after encapsulating the second die and the second conductive pillar, forming a third conductive pillar electrically coupled to the second conductive pillar.