Bonding structure for semiconductor package and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsMin-Fong Shu, Yi-Hsiu TSENG, Kuan-Neng CHEN, Shu-Chiao KUO
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Abstract
The present disclosure relates to bonding structures useful in semiconductor packages and methods of manufacturing the same. In an embodiment, the bonding structure comprises a substrate, having a top surface and including at least one bonding pad, wherein each bonding pad is disposed adjacent to the top surface of the substrate and has a sloped surface; and a semiconductor element including at least one pillar, wherein each pillar is bonded to a portion of the sloped surface of a corresponding bonding pad, and a gap is formed between a sidewall of the pillar and the sloped surface of the corresponding bonding pad.
Claims21
A bonding structure, comprising:
- a substrate, having a top surface and comprising at least one bonding pad, wherein the bonding pad is disposed adjacent to the top surface of the substrate and has a sloped surface;
- and
- a semiconductor element, comprising at least one pillar;
- wherein each pillar is bonded to a portion of the sloped surface of a corresponding one of the at least one bonding pad, and a gap is formed between a sidewall of the pillar and the sloped surface of the corresponding bonding pad;
- wherein the substrate further comprises a first insulation layer disposed on the top surface thereof and between the bonding pads, and the semiconductor element further comprises a second insulation layer between the pillars, wherein the first insulation layer contacts the second insulation layer.
(canceled)
A bonding structure, comprising:
- a substrate, having a top surface and comprising at least one bonding pad, wherein each bonding pad is disposed adjacent to the top surface of the substrate and has a sloped surface with a first slope;
- and
- a semiconductor element, comprising at least one pillar, wherein each pillar is bonded to a portion of the sloped surface of a corresponding one of the at least one bonding pad and has a sidewall with a second slope, and wherein the absolute value of the first slope is less than the absolute value of the second slope.
19-24. (canceled)
Dependencies are inferred from the claim text.