Rf package and manufacturing method thereof
AssigneeElectronics and Telecommunications Research Institute
InventorMyunghoi KIM
Life of this patent
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Abstract
Disclosed is a method of improving performance and increasing a freedom degree of design of an interconnect structure in a radio frequency (RF) package. The RF package may include a package base, a semiconductor die mounted on the package base, a package substrate formed on the package base, the package substrate comprising at least one defected substrate structure (DSS), and a conducting pattern formed on one side of the package substrate and electrically connected with the semiconductor die, wherein the at least one DSS overlaps at least a portion of the conducting pattern in perspective of a top view of the RF package.
Claims20
A radio frequency (RF) package, comprising:
- a package base;
- a semiconductor die mounted on the package base;
- a package substrate formed on the package base, the package substrate comprising at least one defected substrate structure (DSS);
- and
- a conducting pattern formed on one side of the package substrate and electrically connected with the semiconductor die.
A package substrate used for a radio frequency (RF) package, the package substrate comprising:
- at least one defected substrate structure (DSS), wherein the package substrate is combined with one surface of a package base and one surface of a conducting pattern, and the package substrate surrounds a semiconductor die mounted on the one surface of the package base.
A radio frequency (RF) package manufacturing method, the method comprising:
- forming a package base;
- mounting a semiconductor die on the package base;
- forming a package substrate comprising at least one defected substrate structure (DSS) on the package base;
- forming a conducting pattern in one surface of the package substrate;
- and
- electrically connecting the semiconductor die and the conducting pattern.
The method of clam 15, further comprising:
- forming a connection pin on the conducting pattern, the connection pin electrically connected with the conducting pattern.
Dependencies are inferred from the claim text.