Rf package with non-gaseous dielectric material
AssigneeNXP B.V.
InventorsChristian Weinschenk, Amar Ashok Mavinkurve
Life of this patent
Estimating the term…
Abstract
An RF package including: an RF circuit; a non-gaseous dielectric material coupled to the RF circuit, and having a thickness based on a magnetic field in the RF circuit; and an encapsulant material coupled to cover the RF circuit and non-gaseous dielectric material on at least one side of the RF circuit. A package manufacturing method, including: identifying an RF circuit; dispensing a non-gaseous dielectric material upon the RF circuit, wherein at least a portion of the non-gaseous dielectric material has a thickness based on a magnetic field in the RF circuit; and covering the RF circuit and non-gaseous dielectric material with an encapsulant material on at least one side of the RF circuit.
Claims12
A package comprising:
- an RF circuit;
- a non-gaseous dielectric material coupled to the RF circuit, and having a thickness based on a magnetic field in the RF circuit;
- and
- an encapsulant material coupled to cover the RF circuit and non-gaseous dielectric material on at least one side of the RF circuit.
A package comprising:
- an RF circuit having a first portion and a second portion;
- a non-gaseous dielectric material coupled only to the first portion of the RF circuit;
- and
- an encapsulant material coupled to cover the RF circuit and non-gaseous dielectric material on at least one side of the RF circuit.
-18. (canceled)
Dependencies are inferred from the claim text.