Noise cancellation for a magnetically coupled communication link utilizing a lead frame

An integrated circuit package, comprising:

• an encapsulation;
• a lead frame, a portion of the lead frame disposed within the encapsulation, the lead frame comprising:
• a first conductive loop having a first end and a second end, wherein a first voltage is induced between the first and second ends of the first conductive loop in response to an external magnetic field that passes through the integrated circuit package;
• and
• a second conductive loop having a third end and a fourth end, wherein a second voltage is induced between the third and fourth ends in response to the external magnetic field that passes through the integrated circuit package, wherein the first conductive loop is coupled to the second conductive loop such that the first voltage between the first and second ends combined with the second voltage between the third and fourth ends substantially cancel.