Semiconductor device with an isolation structure coupled to a cover of the semiconductor device

A semiconductor device comprising:

• a substrate having a surface;
• an electronic device on the substrate and comprising a first electrical component and a second electrical component;
• a cover on the substrate, wherein the cover extends over at least a portion of the first and second electrical components and comprises a primary wall extending from a first side wall and to a second side wall;
• a first electrical connector on the first side wall of the cover;
• a second electrical connector on the second side wall of the cover;
• and
• an isolation structure comprising a first cross member on the primary wall and extending in between the first electrical component and the second electrical component, the first cross member connected to both the first electrical connector and the second electrical connector, wherein the isolation structure is configured to reduce electromagnetic coupling between the first electrical component and the second electrical component during an operation of the electronic device.

A method of fabricating a semiconductor device with isolation between components of the semiconductor device, the method comprising:

• positioning a first component on a substrate;
• positioning a second component on the substrate;
• positioning a cover to the substrate;
• and
• coupling an isolation structure of electrically conductive material to the cover, the isolation structure having at least a portion that is spaced from and extends over the substrate in between the first component and the second component, wherein the isolation structure is configured to reduce electromagnetic coupling between the first component and the second component during an operation of the semiconductor device.