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US 2016/0240481 A1Published application
Interposer substrate, semiconductor structure and fabricating process thereof
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChia-Ching CHEN, Chin-Li KAO, Hung-Jen CHANG, Tang-Yuan CHEN, Wei-Hong LAI
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Abstract
Described herein are interposer substrate designs for warpage control, semiconductor structures including said interposer substrates, and fabricating processes thereof. An interposer substrate defines a cavity and further includes a reinforcement structure, wherein the reinforcement structure is used to control warpage of the semiconductor package structure.
Claims25
An interposer substrate, comprising:
- a first core layer;
- a first conductive layer on a first side of the interposer substrate and comprising a plurality of first pads;
- a second conductive layer on a second side of the interposer substrate and comprising a plurality of second pads, wherein the second side of the interposer substrate is opposite the first side of the interposer substrate;
- a plurality of conductive vias electrically connecting the first conductive layer and the second conductive layer;
- and
- a reinforcement structure in the interposer substrate;
- wherein the interposer substrate defines a cavity.
4 more elements
17-20. (canceled)
A semiconductor structure comprising:
- a base substrate having a first surface including a plurality of base substrate pads thereon;
- an interposer substrate comprising:
- a first core layer,
- a first conductive layer on a first side of the interposer substrate and comprising a plurality of first pads,
- a second conductive layer on a second side of the interposer substrate and comprising a plurality of second pads,
- a plurality of conductive vias electrically connecting the first conductive layer and the second conductive layer, and
- a reinforcement structure in the interposer substrate, wherein the interposer substrate defines a cavity;
- and
- wherein at least one of the first and the second pads is electrically coupled to at least one of the plurality of base substrate pads;
- and
- a semiconductor device positioned at least partially within the cavity between the base substrate and the interposer substrate.
8 more elements
A substrate, comprising:
- a core layer, the core layer defining an accommodating cavity;
- a first conductive layer disposed on a first surface of the core layer;
- a second conductive layer embedded in the core layer and exposed at a second surface of the core layer;
- a conductive via electrically connecting the first conductive layer with the second conductive layer;
- a first insulating layer disposed over the core layer and the first conductive layer, the first insulating layer exposing portions of the first conductive layer;
- a second insulating layer disposed over the core layer and exposing portions of the second conductive layer;
- and
- a reinforcing structure configured to reduce warpage of the substrate.
5 more elements
Dependencies are inferred from the claim text.