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US 2016/0240447 A1Published application
Driver integrated circuit chip and display device having the same
AssigneeSamsung Display Co., Ltd.
InventorJung-Hoon SHIM
Life of this patent
Estimating the term…
Abstract
A driver integrated circuit chip includes a plurality of monitoring bumps, a plurality of output bumps, a plurality of first inner wires electrically connected to the output bumps, a plurality of second inner wires, and a plurality of switching circuits are electrically connected to the second inner wires. Each of the second inner wires is electrically connected between an adjacent pair of monitoring bumps. Each of the switching circuits controls a connection between adjacent monitoring bumps.
Claims20
A driver integrated circuit chip, comprising:
- a body including a long side and a short side;
- a plurality of monitoring bumps adjacent to the long side of the body;
- a plurality of output bumps adjacent to the short side of the body;
- a plurality of first inner wires electrically connected to the output bumps, respectively;
- a plurality of second inner wires, each of the second inner wires electrically connected between an adjacent pair of monitoring bumps;
- and
- a plurality of switching circuits electrically connected to the second inner wires, wherein each of the switching circuits is to control a connection between adjacent ones of the monitoring bumps.
4 more elements
A display device, comprising:
- a display panel including a peripheral region adjacent to a display region;
- a driver integrated circuit chip in the peripheral region;
- a first pad in the peripheral region and contacting the chip;
- and
- a second pad in the peripheral region and contacting a flexible printed circuit board, wherein the chip includes:
- a body including a long side and a short side;
- a plurality of monitoring bumps adjacent to the long side of the body;
- a plurality of output bumps adjacent to the short side of the body;
- a plurality of first inner wires electrically connected to the output bumps;
- a plurality of second inner wires electrically connecting between the monitoring bumps;
- and
- a plurality of switching circuits electrically connected to the second inner wires.
9 more elements
Dependencies are inferred from the claim text.